應用田口實驗設計法最佳化於SMT印刷之研究

The Research of SMT Printing By Applying Taguchi Design of Experiment Optimization

廖家祥(Chia-Hsiang Liao)

指導教授 ： 顧瑞祥

國立虎尾科技大學/管理學院/工業工程與管理研究所/碩士(2013年)

摘要

由於表面黏著技術( Surface Mount Technology , SMT )年來已趨向輕、薄、短、小、大容量及快速運算速度之記憶體模組產品。在面對先進的SMT技術時，對於印刷電路板之錫膏印刷製程的要求日趨重要。本研究針對SMT錫膏印刷製程以田口式實驗計劃法( Design of Experiment , DOE) ， 提升印刷品質之穩定性並減少生產前置時間之浪費。首先利用量測系統分析(Measurement Systems Analysis , MSA）來評估SPI 機台之錫膏厚度的量測能力，探查量測系統的重複性及再現性(Gauge Repeatability & Reproducibility, GR&R)是否符合要求。再運用田口方法規劃印刷實驗，觀察錫膏厚度之因子，結合變異數分析（Analysis of Variance , ANOVA）來設計之最佳參數組合可行性，其驗證結果整體錫膏厚度的Cpk製程能力指標( Process Capability Index , Cpk ) 改善由原本的1.132 提高增加至1.775 ，將求得之錫膏印刷最佳參數組合提供給廠商生產之參考。

關鍵字

SMT ； 實驗設計法 ； 量測系統分析 ； ANOVA ； Cpk

並列摘要

Surface Mount Technology (SMT) of memory module products has been trending to light, thin, short, small, high-capacity and high-speed operation in recently. For printing process of printed circuit board, it has been becoming increasingly important when it meets advanced SMT. In this study, it focuses on SMT printing process of printed circuit board and proposes Taguchi design of experiment (DOE), in order to enhance the stability of the print quality and reduce production lead-time wasted. First use Measurement Systems Analysis (MSA) to evaluate the SPI machine thickness of the solder paste measurement capability to confirm the measurement system repeatability and reproducibility (Gauge Repeatability & Reproducibility, GR&R) meets requirements. Then use Taguchi method to work out print experiment, and then observes solder paste thickness factor, combines with the analysis of variance (ANOVA) to design the best combination of parameters, and in the end verify the results of the overall solder paste thickness CPK improvement increased from the original 1.132 to 1.775. The solder paste printing will obtain the best combination of parameters available to the manufacturers of reference.

並列關鍵字

SMT ； Design of Experiment ； Measurement Systems Analysis ； ANOVA ； Cpk

參考文獻

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