無鉛複合銲錫製備與特性之研究

Study on The Preparation and Characterization of Composite Lead-Free Solder

潘憲澤(Sian-Ze Pan)

指導教授 ： 黃和悅

國立虎尾科技大學/工程學院/材料科學與綠色能源工程研究所/碩士(2010年)

摘要

摘 要
本研究是添加強化材料於SAC305合金中，針對銲錫接合特性與顯微組織進行探討。在實驗中先以熱壓法製作SAC305-nX無鉛複合銲錫 (n = 0.05、0.1、0.5.、1.0Vol%，X=奈米碳管、鋅、鋁)，然後以Kovar合金和純銅金屬做為基板並塗佈助銲劑，在210℃至270℃溫度區間進行可銲性實驗，再對接合後之試片進行150℃的熱儲存實驗0~50小時後並探討介金屬化合物的變化，最後以SEM及EDS分別進行顯微組織觀察與界面反應之分析。
由實驗結果得知，銅基板的潤濕能力相對於Kovar基板，具有較好的潤濕能力。在相同基材的情況下在240℃~250℃工作溫度及適當地使用助銲劑，對於添加0.01wt.%的奈米碳管、0.5Vol.%鋁或0.5Vol.%之鋅的SAC305-nX無鉛複合銲錫所呈現的潤濕性為最佳。SAC305/Cu於270℃溫度下所得之界面反應層的組成成分為Cu6Sn5+Cu3Sn；當添加奈米碳管、Zn或Al時，SAC305-nX/Cu無鉛複合銲錫的界面顯微組織將不會出現Cu3Sn。SAC305/Kovar與SAC305-nX/Kovar的界面反應層的組成成分皆為Ni3Sn4。此外，隨著奈米碳管、鋅、鋁之添加比例的提昇與熱儲存時間之增加，皆會使界面反應層之厚度增加。

關鍵字

複合銲錫 ； 潤濕性 ； 奈米碳管 ； 顯微結構 ； 介金屬化合物 ； 熱儲存

並列摘要

Abstract
The solder joint behaviors and microstructures of Sn-3Ag-0.5Cu (SAC305) based carbon nanotube (CNT), Cu or Zn reinforced composite solders were investigated. The hot-pressing method was used to produce composite solders, which the reinforcements content in the SAC305 was 0.01 to 1 vol.%. Copper and Kovar substrates with and without flux coating were used for solderability tests. Specimens were heated rapidly to achieve the desired temperature (in the range from 210 to 270℃) and then cooled to room temperature. Thermal storage was performed at 150℃ up to 50 hours to induce solid state intermaterlic compound (IMC) growth for solder joints. In the SEM-EDS analysis of all solder joint samples, particularly were focused on the formation and growth of intermetallic layers around reinforcements in the composite solder and at the copper or Kovar substrate-solder interface.
The experimental results indicate that the copper substrate good wetting angles as well as good spreading areas. The 0.1vol.% CNT, 0.1vol.% Al or 0.5vol% Zn reinforced composite solder showed the best wettability which solder joint temperature was 240-250℃ approximately. Under a high reaction temperature of 270℃, the Cu6Sn5 and Cu3Sn were main IMCs formed between copper substrate and composite solders. When the CNT, Cu or Zn was added as reinforced composite solders, it had been observed that Cu3Sn disappeared from the reaction zone. The Ni3Sn4 IMC at the reinforced composite solders and Kovar interface was observed. Longer high temperature storage time significantly increased the thickness of IMC. Besides, the growing rate of IMC layer increased with increasing reinforcement content.
Keywords: composite solder

並列關鍵字

Composite solder ； Wettability ； Carbon nanotube ； microstructure ； Intermetallic compound ； Thermal storage

參考文獻

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