Translated Titles

A study on the Electrophoretic deposition assisted bamboo carbon polishing effect



Key Words

搖擺. ; 表面粗糙度 ; 拋光 ; 多孔性 ; 電泳沉積 ; 竹碳 ; electrophoretic deposition ; bamboo carbon ; porosities ; polishing ; surface rounghness ; rocking.



Volume or Term/Year and Month of Publication


Academic Degree Category




Content Language


Chinese Abstract

精密微細加工是多年來機械產業發展焦點,多位學者已突破傳統加工技術,利用電泳沈積法來做拋光實驗且有具體成果展現,如何更有效提昇拋光效率與品質,是緊接著要研究的課題。本實驗的目的是持續研究運用電泳沉積輔助,以自行研發可控制轉速之竹碳拋光主軸附加於研磨設備,提升矽晶圓鏡面拋光效果,並針對試片作表面粗糙度量測與形貌觀察,此外對會影響品質的參數進行分析探討。使用之拋光液分別添加碳化矽及鑽石粉末,利用竹碳多孔性與比表面積大之特點,以二相流體形態將磨粒傳輸至竹碳主軸端部進行拋光。實驗參數有拋光液濃度、時間、荷重、竹碳主軸轉速、拋光盤轉速、工作電壓等。竹碳施壓於工件表面時,磨粒會對工件進行磨削,吸附於竹碳維管束內之磨料亦因竹碳表層崩解,形成再生和自銳功用而持續對工件表面反覆加工來提升拋光效果。實驗結果證實,竹碳在矽晶圓製程中,藉由電泳沉積輔助,可使矽晶片表面粗糙度值加速降低及提高改善效率;而且,無論使用碳化矽或鑽石粉末做為拋光液磨料,並運用搖擺機能可大幅移除加工過程中所造成的加工殘痕,表面粗糙度改善效能更加顯著,並快速形成鏡面反射效果。 關鍵字:電泳沉積、竹碳、多孔性、拋光、表面粗糙度、搖擺。

English Abstract

For many years, Precision micro-machining is the focus of development in machinery industry. Number of scholars had already broken through the traditional processing technology. They used Electrophoretic deposition (EPD) method to do polishing experiments, and they had specific results. But how to improve more efficiency and quality of polishing, that is the next subject what we have to research. This experiment objective is continue to use self-developed bamboo carbon polishing spindle which can be control rotary speed ,and which installed to the grinding equipment. by electrophoretic deposition to assist the bamboo carbon to achieve mirror-polished to enhance the effects of mirror-polished silicon wafer, the surface of specimen were measured and observed. Moreover, and then the parameters that affect quality were analyzed and discussed. The slurry in this experiment each adds powder of SiC and Diamond. Use porosities and bigger specific surface area advantages of bamboo carbon, and has polish let the abrasive transport to bamboo carbon grinding side by the two-phase fluid type. The numbers of experiment have slurry concentration, time, load, spindle speed and polishing plate speed act. When the bamboo carbon push on the workpiece surface, the abrasive will grinding, And because the bamboo carbon surface collapsed, Resulting recycled and self-sharpening effectiveness, and continuous on the workpiece surface repeatedly machining, to raise the polishing effect. The experimental results confirmed, bamboo carbon were in the silicon wafer regeneration machining process, assisted by electrophoretic deposition, can accelerate the reduction of silicon surface roughness and improve the efficiency. No matter what the polishing abrasive is powder of SiC or Diamond, it can use the rocking function can significantly remove machining marks in the machining process. And improvement the surface rounghness of silicon wafer in fast, also can have result of mirror reflection in quickly. Keywords: electrophoretic deposition, bamboo carbon, porosities, polishing, surface rounghness, rocking.

Topic Category 工學院 > 機械工程研究所碩士在職專班
工程學 > 機械工程
  1. 1.J. Hopenfeld, R.R. Cole, Prediction of the one-dimensional equilibrium cutting gap in electrochemical machining, Transaction of ASME J. Eng. Ind., Vol.91, pp.764-765, 1969.
  2. 2.Y. Yamamoto, H. Maeda, H. Shibutani, H. Suzuki and O. Horiuchi, A study on constant-pressure grinding with EPD pellets, Key Engineering Materials, Vol.257-258, pp.135-140, 2004.
  3. 10.T. Oshita, Y. Sawaki, M. Kishimoto, Grinding performance of pellet prepared using nanosize ceria particles, Journal of Alloys and Compounds, Vols.408-412, pp.1118-1122, 2006.
  4. 11.N. Kobayashia, Y. Wub and M. Nomurab, Precision treatment of silicon wafer edge utilizing ultrasonically assisted polishing technique, Journal of Materials Processing Technology, Vol.201, pp.531-535, 2007.
  5. 12.A. Q. Biddut, L. C. Zhang, Y. M. Alia, “Damage-free polishing of monocrystalline silicon wafers without chemical additives”, Scripta Materialia, Vol.59, pp.1178-1181, 2008.
  6. 13.L. M. Cook, Chemical processes in glass polishing, Journal of Non-Crystalline Solids, Vol.120, pp.152-171, 1990.
  7. 15.崔海平,「電化學結合電泳精密拋光不銹鋼之研究」,國立中央大學 博士論文,民國97年6月。
  8. 3.王建榮、林必窈、林慶福等編譯,「半導體平坦化CMP 技術」,全華科技圖書股份有限公司,民國89 年6 月。
  9. 4.國立中央大學機械所,「學界合作轉委托研究報告」,金屬工業研究發展中心2006年學界合作研究報告,p.15,民國95年10月。
  10. 5.J. Grillaert, M. Meuris, N. Heylen, K. Devriendt and E. Vrancken, Modelling step height reduction and local removable rates based on pad-substrate interactions, CMP-MIC conference, California, p.79, 1998.
  11. 6.原宣宏、鈴木哲雄、井上秀敏、高田悟等,「Si 再生方法開?」,神?製鋼技報,Vol. 48, No. 3,Dec. 1998。
  12. 7.邱能信,「矽晶圓之超精密輪磨及化學機械拋光技術」,機械工業雜誌,民國85年5月。
  13. 8.C. Chen, M. Leipold, Fracture toughness of silicon, American Ceramic Society Bulletin, vol.59, pp.469-472, 1980.
  14. 9.Peter B. Hirsh、角田 直人,「脆性-延性遷移基礎」,日本金????報, Vol.29,pp.5-17,1990。
  15. 14.陳正德,「碳化矽的電泳沈積現象探討」,國立中央大學 碩士論文,民國91年6月。
  16. 16.林秉威,「竹炭拋光矽晶圓特性之研究」,國立中央大學 碩士論文,民國99 年 6 月。
  17. 17.莊英鍠,「鑲入鎳-鑽石顆粒複合鍍層的竹碳工具之研發及其研磨加工特性研究」,國立中央大學 碩士論文,民國100年 7 月。
Times Cited
  1. 鍾登凱(2014)。竹碳運用於不鏽鋼的電解複合拋光效果之研究。中央大學機械工程學系學位論文。2014。1-84。
  2. 吳宗成(2015)。竹炭拋光矽晶圓添加二氧化鈰之加工特性研究。中央大學機械工程研究所碩士在職專班學位論文。2015。1-97。