stands for Digital Object Identifier
and is the unique identifier for objects on the internet. It can be used to create persistent link and to cite articles.
Using DOI as a persistent link
To create a persistent link, add「http://dx.doi.org/」
before a DOI.
For instance, if the DOI of an article is 10.5297/ser.1201.002 , you can link persistently to the article by entering the following link in your browser: http://dx.doi.org/ 10.5297/ser.1201.002 。
The DOI link will always direct you to the most updated article page no matter how the publisher changes the document's position, avoiding errors when engaging in important research.
Cite a document with DOI
When citing references, you should also cite the DOI if the article has one. If your citation guideline does not include DOIs, you may cite the DOI link.
DOIs allow accurate citations, improve academic contents connections, and allow users to gain better experience across different platforms. Currently, there are more than 70 million DOIs registered for academic contents. If you want to understand more about DOI, please visit airiti DOI Registration （ doi.airiti.com ） 。
- Ahn, S. H. and Kim, Y. K., “Fabrication and experiment of a planar micro ion drag pump”, Sensors and Actuators A., Vol. 70, pp. 1-5, 1998.
- Alley, R., Soto, M., Kwark, L., Crocco, P., and Koester, D., “Modeling and Validation of On-Die Cooling of Dual-Core CPU using Embedded Thermoelectric Devices”, 24th IEEE SEMI-THERM Symposium, San Jose, CA, USA, 2008.
- Gerlach, T., Schuenemann, M., and Wurmus, H., “A New Micropump Principle of The Reciprocating Type Using Pyramidic Micro Flow Channels as Passive Valves”, Journal of Micromechanics and Microengineering, Vol. 5, pp. 199-201, 1995.
- Heffington, S. N., Black, W. Z., and Glezer, A., “Vibration-Induced Droplet Atomization Heat Transfer Cell For High-Heat Flux Applications”, Intersociety Conf. on Thermal and Thermomecha.l Phenomena in Electronic Systems, pp. 408-412, 2002.
- Huang, C. Y., Wang, S. W., Lin, H. W., and Lin, W. K., “The Fabrication of the Micro-Capillary-Pumped-Loop”, Thermal Engineering Summer Heat Transfer Conference, Vancouver, BC, Canada, 2007.
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