DOI
stands for Digital Object Identifier
(
D
igital
O
bject
I
dentifier
)
,
and is the unique identifier for objects on the internet. It can be used to create persistent link and to cite articles.
Using DOI as a persistent link
To create a persistent link
「
https://doi.org/
」
before a DOI.
For instance, if the DOI of an article is
10.5297/ser.1201.002
, you can link persistently to the article by entering the following link in your browser:
https://doi.org/
10.5297/ser.1201.002
。
The DOI link will always direct you to the most updated article page no matter how the publisher changes the document's position, avoiding errors when engaging in important research.
Cite a document with DOI
When citing a document with a DOI, the DOI permanent URL should always be presented (if using APA or Chicago format, present https://doi.org/DOI number). If using a citation format that does not specify DOI, the DOI permanent URL should still be presented as a priority.
DOIs allow accurate citations, improve academic contents connections, and allow users to gain better experience across different platforms. Currently, there are more than 70 million DOIs registered for academic contents. If you want to understand more about DOI, please visit airiti DOI Registration ( doi.airiti.com ) 。
Gap Narrowing for CMOS-MEMS Resonators via Constructive Utilization of Structural Stress
鄭洪森 , Masters Advisor:李尉彰
繁體中文
DOI:
10.6342/NTU202203817
微機電 ; 傳感間隙 ; 動態阻抗 ; 雙邊固定共振器 ; 共振式開關 ; CMOS-MEMS ; transducer gap ; motional impedance ; clamped-clamped beam ; resoswitch


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- [3] W.-C. Chen, W. Fang, and S.-S. Li, "A Generalized CMOS-MEMS Platform for Micromechanical Resonators Monolithically Integrated with Circuits," Journal of Micromechanics and Microengineering, vol. 21, no. 6, p. 065012, 2011.
- [4] J. Zhu et al., "Development Trends and Perspectives of Future Sensors and MEMS/NEMS," Micromachines, vol. 11, no. 1, p. 7, 2019.
- [5] G. M. Rebeiz, C. D. Patel, S. K. Han, C.-H. Ko, and K. M. Ho, "The Search for A Reliable Mems Switch," IEEE microwave magazine, vol. 14, no. 1, pp. 57-67, 2013.