壓克力-奈米金與環氧樹脂壓克力-奈米金奈米複合材料
之製備與性質研究

陳霈桓

doi:10.6846/TKU.2007.00360

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壓克力-奈米金與環氧樹脂壓克力-奈米金奈米複合材料之製備與性質研究

Preparation and Properties of Acrylate-Nanogold and Epoxy Acrylate-Nanogold Nanocomposites

陳霈桓 , Masters　　Advisor：張朝欽　　

繁體中文 DOI： 10.6846/TKU.2007.00360

奈米金；環氧樹脂壓克力；壓克力；高分子-奈米金奈米複合材料； nanogold ； Epoxy Acrylate ； methyl methacrylate ； polymer-nanogold ； nanocomposites

Abstract │ Reference (65) │ Altmetrics

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This research divides into two parts. The first part is the preparation of MUD coated nanogold (AuMUD) and its blend with epoxy acrylate. AuMUD have OH furetion groups on the particle surface. Thus, the hydrogen bond was formed with the C=O groups of epoxy acrylate. The second part is the preparation of MPS coated nanogold (AuMPS) and its nanocomposites with poly(MMA-co-MSMA). The covalent bond between AuMPS and the copolymer was formed by the hydrolysis and condensation reactions with suitable water as the catalyst. The effects of AuMPS size on the properties of the nanocomposites was also studied in this study. 
The unique of this study are the preparation of the solid polymer-nanogold nanocomposites and thin films by the chemical bonding between the polymers and nanogold in order to increase the contain of nanogold in the nanocomposite or thin film and the effects of nanogold on the structures and properties of the polymers in order to increase the application range. From the research results, the AuMUD/epoxy acrylate nanocomposite with 0.01 wt% nanogold has the best dispersion of the nanogold in the matrix, the highest thermal decomposition temperature, and better hydrophobic ability and hardness. The AuMPS/acrylic nanocomposite with 0.1 wt% nanogold(Au:MPS = 1:5) has the best dispersion of the nanogold in the matrix, the highest thermal decomposition temperature, and better hydrophobic ability and hardness.

Reference ( 65 ) 〈TOP〉

1. Chang, S. S.; Shih, C. W.; Chen, C. D.; Lai, W. C.; Wang, C. R. C. Langmuir 1999, 15, 701.
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10. Chang, S. S.; Shih, C. W.; Chen, C. D.; Lai, W. C.; Wang, C. R. C. Langmuir 1999, 15, 701.
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