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Search Symbol (Half-width) Description of Search Symbols
Space "AND" indicates the intertwining of key terms used in a search
Double Quotation Marks ("") ( " " ) Double quotation marks indicate the beginning and end of a phrase, and the search will only include terms that appear in the same order of those within the quotations. Example: "image process" : " image process "
? Indicates a variable letter. Entering two ? will indicate two variable letters, and so on. Example: "Appl?", search results will yield apple, apply… e , appl y … ( (often used to English word searches) )
* Indicates an unlimited number of variable letters to follow, from 1~n. Example: Enter "appl*", search results will yield apple, apples, apply, applied, application…(often used in English word searches) e , appl es , appl y , appl ied , appl ication … ( (often used to English word searches) )

Boolean logic combinations of key words is a skill used to expand or refine search parameters.
(1) AND (1) AND: Refines search parameters
(2) OR (2) OR: Expands search parameters (3) NOT: Excludes irrelevant parameters


DOI stands for Digital Object Identifier ( D igital O bject I dentifier ) ,
and is the unique identifier for objects on the internet. It can be used to create persistent link and to cite articles.

Using DOI as a persistent link

To create a persistent link, add「」 「 」 before a DOI.
For instance, if the DOI of an article is 10.5297/ser.1201.002 , you can link persistently to the article by entering the following link in your browser: 10.5297/ser.1201.002
The DOI link will always direct you to the most updated article page no matter how the publisher changes the document's position, avoiding errors when engaging in important research.

Cite a document with DOI

When citing references, you should also cite the DOI if the article has one. If your citation guideline does not include DOIs, you may cite the DOI link.

DOIs allow accurate citations, improve academic contents connections, and allow users to gain better experience across different platforms. Currently, there are more than 70 million DOIs registered for academic contents. If you want to understand more about DOI, please visit airiti DOI ) 。

Abstract 〈TOP〉
Parallel Abstract 〈TOP〉
Reference ( 49 ) 〈TOP〉
  1. 1. C. C. Wei, P. C. Liu, C. Chen, J. C. B. Lee, and I. P. Wang, “Relieving Sn whisker growth driven by oxidation on Cu leadframe by annealing and reflowing treatments”, Journal of Applied Physics, Vol. 102, pp. 043521-1-043521-7 (2007).
  2. 2. J. Cheng, S. Chen, P. Vianco, and J. C. M. Li, “A new mechanism for hillock over electrodeposited thin tin film”, IEEE Electronic Components and Technology Conference, pp. 472-477 (2008).
  3. 3. 張道智、張喬雲、游善溥,無鉛組裝技術現況與趨勢,電子工業研究所,工業技術研究院,p1-19 (2001)。
  4. 4. S. K. Lin, Y. Yorikado, J. Jiang, K. S. Jim, K. Suganuma, and S. W. Chen, “Mechanical deformation-induced Sn whisker growth on electroplated films in the advanced flexible electronic packaging”, Journal of Electronic Materials, Vol. 22(7), pp. 1975-1986 (2007).
  5. 5. H. Wang, F. Gao, X. Ma, and Y. Qian, “Reactive wetting of Cu and Cu6Sn5/Cu3Sn/Cu substrates using wetting balance”, Scripta Materialia, Vol. 55, pp. 823-826 (2006).
Times Cited (2) 〈TOP〉
  1. 楊卓朕(2010)。以四點彎矩方法探討外加應力與銅-錫介金屬層生成關係。中興大學精密工程學系所學位論文。2010。1-68。
  2. 賴韋翰(2012)。熱遷移效應對Sn/Cu界面之研究。中正大學化學工程學系學位論文。2012。1-225。
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