DOI
stands for Digital Object Identifier
（
D
igital
O
bject
I
dentifier
）
,
and is the unique identifier for objects on the internet. It can be used to create persistent link and to cite articles.
Using DOI as a persistent link
To create a persistent link, add「http://dx.doi.org/」
「
http://dx.doi.org/
」
before a DOI.
For instance, if the DOI of an article is
10.5297/ser.1201.002
, you can link persistently to the article by entering the following link in your browser:
http://dx.doi.org/
10.5297/ser.1201.002
。
The DOI link will always direct you to the most updated article page no matter how the publisher changes the document's position, avoiding errors when engaging in important research.
Cite a document with DOI
When citing references, you should also cite the DOI if the article has one. If your citation guideline does not include DOIs, you may cite the DOI link.
DOIs allow accurate citations, improve academic contents connections, and allow users to gain better experience across different platforms. Currently, there are more than 70 million DOIs registered for academic contents. If you want to understand more about DOI, please visit airiti DOI Registration （ doi.airiti.com ） 。
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化學添加劑對於化學方法製備銅奈米顆粒及銅薄膜於聚亞醯胺上之特性研究
廖國良 , Masters Advisor：竇維平
繁體中文
聚亞醯胺 ； 濕製程 ； 無電電鍍銅 ； 化學添加劑 ； 奈米粒子 ； Polyimide (PI) ； Wet process ； Electroless Copper Deposition ； chemical additives ； Nanoparticles
- 10. J. H. Hong, Y. Lee, S. Han, K. J. Kim, “Improvement of Adhesion Properties for Cu Films on the Polyimide by Plasma Source Ion Implantation”, Surface & Coating Technology, 2006, 201, 197.
連結：
- 11. J. H. Das, J. E. Morris, “Diffusion and Self-Gettering of Ion-Implanted Copper in Polyimide”, Journal of Applied Physics, 1989, 66, 5816.
連結： - 12. S. Bhansali, D. K. Sood, “A Novel Technique for Fabrication of Metallic Structures on Polyimide by Selective Electroless Copper plating Using Ion Implantation”, Thin Solid Films, 1995, 270, 489.
連結： - 13. D. Chena, Y. Lia, Q. Lua, J. Yina, Z. Zhu, “Selective Silver Seeding on Laser Modified Polyimide for Electroless Copper Plating”, Applied Surface Science, 2005, 246, 167.
連結： - 14. H. Niino, A. Yabe, “Excimer Laser Polymer Ablation: Formation of Positively Charged Surfaces and Its Application into the Metallization of Polymer Films”, Applied Surface Science, 1993, 69, 1.
連結：
