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  • 學位論文

天線封裝環氧樹脂複合材料之特性研究

Properties of Epoxy Resin Composites for Chip Antenna Packaging

指導教授 : 莊祖煌 鄭國忠
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摘要


本研究首先利用環氧樹脂(D.E.R.331)摻混含有鈦酸鋇陶瓷粉末,以硬化劑 4,4-methylene dianiline(MDA)混合,製成不同配方之複合材料,並觀察其介電常數 (ε’)、玻璃轉移溫度(Tg)、熱裂解溫度及截面形態,發現在高頻1GHz 下,介電常數隨著陶瓷粉末含量增加而有所提升,其中加了70 wt% NPO-40M 陶瓷粉末,在頻率1GHz下的介電常數,從原本的3.2提升到8.3,而介電損失(ε')則從原本的0.071提高至0.13。此外,將具有液晶態的環氧樹脂biphenol epoxy (BP)與硬化劑sulfanilamide(SAA)混合後,再添加不同比例Y5V陶瓷粉末,當添加量為70wt%時,在頻率1GHz下的介電常數,從原本的3.6提升到12.2,而介電損失(ε')則從原本的0.054提高至0.21。另外,在此並藉由Lichtenecker模式來描述不同粉末含量比對介電常數的影響。 接著利用流變儀來測量在不同溫度條件下,複合材料(D.E.R331/MDA/NPO-40M)之黏度,並利用五參數之modified dual Arrhenius化學流變黏度模式來預測在不同硬化溫度條件下之升溫黏度曲線,結果呈現不錯的吻合性。 最後將所製成的環氧樹脂/陶瓷粉末複合材料與晶片天線做封裝,測量其反射損失與遠場輻射場形,可以發現到此晶片天線為雙頻的設計,並發現晶片天線中心頻率隨覆蓋之封裝材料的厚度或介電常數增加而下降,其中D.E.R.331/MDA/60wt% Y5V、D.E.R.331/MDA/60wt% NPO-40M作為封裝材之天線,在2.4GHz頻段的中心頻率約為2.46GHz,且平均頻寬達138MHz,天線增益最高可達0.11dBi。而在5.8GHz頻段,其平均頻寬為至少也有800MHz,天線增益也可達到0.012dBi,因此這種晶片天線在經過封裝後可適用於 IEEE802.11a、b/g 、Bluetooth 等商業規格。

並列摘要


Epoxy resins (D.E.R.331) were mixed with ceramic powders with high dielectric constant; then the mixtures were cured with 4,4-methylene dianiline (MDA). It was found that the dielectric constant at high frequency, 1GHz, increases with the solid content of ceramics. By adding 70 wt% of NPO-40M fillers, the dielectric constant at 1GHz can be increased from 3.2 to 8.3, and the loss factor is about 0.13 at 1GHz. Furthermore, liquid crystalline biphenol epoxy (BP) resin was synthesized and mixed with barium titanate powders (Y5V), then cured with sulfanilamide (SAA). By adding 70 wt% of Y5V fillers, the dielectric constant at 1GHz can be increased from 3.6 to 12.2, and the loss factor is about 0.21 at 1GHz. A Lichtenecker‘s mixing model was proposed to describe the dielectric constant profile dependent on the filler loading, and this model fit the measured data very well. A modified chemorheology model with five-parameters was proposed to describe the viscosity profiles of the epoxy curing system under various curing temperature. The properties of chip antenna, such as return loss S11 and radiation patterns, were further measured. It was found that the chip antenna is a double band, and the effect center frequency decrease with the thickness or dielectric constant of the packaging formed by the epoxy composites. The antenna packaged with D.E.R.331/MDA/ 60wt% Y5V or D.E.R.331/MDA/60wt% NPO-40M is satisfied with specifications of IEEE 802.11a、b/g and Bluetooth.

參考文獻


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