創新技術商品化影響因素之研究-以基板內藏被動元件產業為例

A Study on Influence Factors of Commercializing New Technologies -Using Embedded Passives Technology as an Example

賴信助(Shinn-Jun Lai)

指導教授 ： 鍾清枝 ； 黃廷合

國立臺北科技大學/機電學院/機電整合研究所/碩士(2011年)

https://doi.org/10.6841/NTUT.2011.00360

摘要

國內由晶圓代工帶動的封裝、印刷電路板、材料、模組及通訊、資訊產品等上、中、下游產業經過一、二十年的發展已很完整，但隨著競爭及產業成熟技術外移，為產業技術升級根留台灣，發展先進的系統級構裝(SiP，System in Package)技術是可與大陸區隔並保有技術領先優勢的方向。
本研究以基板內藏被動元件產業為例，以相關之原材料產業、電路板產業、封裝產業、系統模組應用產業等領域之高階主管或資深工程師為研究對象，採用「德菲法」專家意見調查研究法，瞭解國內基板內藏被動元件產業相關業者，決定投入或尚未投入此技術領域量產之相關影響因素，並作為未來研發機構投入創新技術研發之規劃依據。
研究結果發現「技術發展與成熟度」方面，技術發展趨勢與上、中、下游產業供應鏈及人才、設計環境；「技術產業鏈與市場」方面，穩定的材料及製程技術與第二供應商來源、先有下游應用環境及產品需求、上(下)游客戶先採用、市場需求確定；「競爭技術與成本」方面，技術主流、有技術或功能與智財權的競爭優勢、降低成本；「商品化策略與智慧財產權」方面，創新技術必須在短期內接單量產、專利是否侵權、自有的專利群組及保護之地域等皆是影響廠商導入量產的因素。

關鍵字

技術商品化 ； 德菲法 ； 內藏被動元件 ； 內藏基板

並列摘要

The industrial chain of semiconductor including IC foundry , packaging , printed circuit board manufacturing , module assembly , information and communication product has been developed successfully in Taiwan for past decades. For leading technology development and technology differentiation with China, it is emergent to develop advanced system-in-package (SiP) technology while traditional semiconductor industry manufacturers are migrating to foreign countries.
To study the factors which could effect the decision for introducing the embedded passive (Built-In substrate) technology to mass production, this research apply Delphi method to survey and investigate the expert opinions from senior engineers and high rank managers of the material suppliers , printed circuit board manufactures, packaging houses and system product manufactures. This research also provides guidelines for research institutes which would develop the innovative technology.
This research discovers key factors which could effect the manufacture’s decision for mass production of embedded passive technology in four dimensions.
In the dimension of “Technology development and technology maturity” , the key factors are technology trend , suppliers in whole industrial chain, human resource and design tools.
In the dimension of “Industrial chain and market”, the key factors are stable material suppliers and stable technology providers, second source of material and process manufactures, demand from product and field application , customer demand from end product , certainty of market.
In the dimension of “Competitive technology and cost” , the key factors are main stream technology , strength of technology , product function and intellectual properties and capability of cost down.
This research also show transition from innovative technology to mass production , patent quality , patent family and patent portfolio are key factors in the dimension of “Commercialization strategy and intellectual properties”

並列關鍵字

New Technology Commercialization ； Delphi-Method ； Embedded Passives Technology ； Built-In Substrate

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