塑膠捲軸(Plastic Reel)IC半導體包材應用於圓盤在旋轉時必須控制在上下3mm內。本研究利用Moldex3D CAE分析軟體,探討塑膠捲軸之品質特性翹曲變形,在不同的製程參數下,應用田口方法(Taguchi Method) 的L8(27) 直交表進行干擾實驗,再以內直交表L18(21x37) ,外直交表L4(23) 進行主實驗,規劃出射出成形參數的因子與水準,探討成形參數對塑膠捲軸Y方向位移之影響。利用變異數分析(analysis of variance)作因子的重要性測試,並優化的製程參數進行模擬分析,藉由信賴區間(confidence計算加以驗證。分析結果顯示,在95%信賴水準之下,影響Y方向位移最顯著因子為保壓壓力(MPa),其次為保壓時間(sec),藉由確認實驗與信賴區間的計算結果,顯示出模擬分析值與預測直是相當接近的。
Plastic Reel (Reel) IC semiconductor package material used when rotating disc must be controlled within 3mm up and down. In this study Moldex3D CAE analysis software to explore the plastic reel of quality characteristics warpage in a different process parameters, the application of the Taguchi method (Taguchi Method) of L8 (27) orthogonal array interference experiments, and then within the orthogonal array L18 (21x37 ), outer orthogonal array L4 (23) for the main experiment, plan out injection molding parameters factors and levels to explore forming parameters on plastic reels Y-direction displacement effects. The use of factor analysis of variance for the importance of testing, and optimization of process parameters for simulation analysis, verified by calculation of confidence intervals. The results showed that in 95% confidence level, the most significant impact on the Y-direction displacement factor of packing pressure (MPa), followed by the dwell time (sec), confirmed by experimental results and confidence intervals were calculated, showing simulation analysis and forecast values are quite close to straight.