微型喇叭音箱及出音孔之設計與分析

Design and Analysis of Enclosure and Open Hole of Micro-speakers

蔡長安(Chang Cai)

指導教授 ： 劉興華

國立臺北科技大學/機電學院/車輛工程系所/碩士(2006年)

https://doi.org/10.6841/NTUT.2006.00401

摘要

近年來3C產業的快速發展，手機與筆記型電腦等3C產品對於聲音逐漸重視其音質，而在這些產品裡使用的揚聲器為微型喇叭。由於微型喇叭應用時其前容積，後容積，音孔大小及分佈會影響喇叭之性能表現，故本文是針對微型喇叭其前容積，後容積，音孔大小及不同分佈位置的改變，進行測試與分析。實驗利用音頻測試系統CLIO來測量微型喇叭單體特性加上前容積，後容積，音孔洩漏面積，音孔不同分配位置的條件。並利用阻抗曲線得到喇叭單體的T-S參數，再將參數帶入類比電路模擬，以便預測喇叭之特性曲線。且藉由EMA(Electro-Mechano-Acoustical)系統的類比電路、將前容積、後容積、音孔洩漏面積，音孔不同位置對微型喇叭頻率響應的影響，轉換成類比電路中的電感，電阻，電容等元件的組合，期望未來對於微型喇叭音效的設計時，能有效的設計及評估音箱且有規則可以依循。

關鍵字

微型喇叭 ； 類比電路 ； 音箱

並列摘要

Recently, audio performance becomes an important issue of the 3C products such as mobile phone and notebook. Micro-speakers are widely used in these products. The audio performance depends on the enclosure and open holes design. The aim of this research is to study the effect of the enclosure (front and rear) and also the size and pattern of open holes. Experiments are measured with the CLIO audio test system in a semi-anechoic room. The front-rear enclosure and open hole can be modeled as electric components in an analogous circuit of the EMA (Electro-Mechano-Acoustical) system. It can effectively simulate the audio performance in the product design stage.

並列關鍵字

Micro-speaker ； Analogous circuit ； Enclouse

參考文獻

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