DOI
stands for Digital Object Identifier
(
D
igital
O
bject
I
dentifier
)
,
and is the unique identifier for objects on the internet. It can be used to create persistent link and to cite articles.
Using DOI as a persistent link
To create a persistent link, add「http://dx.doi.org/」
「
http://dx.doi.org/
」
before a DOI.
For instance, if the DOI of an article is
10.5297/ser.1201.002
, you can link persistently to the article by entering the following link in your browser:
http://dx.doi.org/
10.5297/ser.1201.002
。
The DOI link will always direct you to the most updated article page no matter how the publisher changes the document's position, avoiding errors when engaging in important research.
Cite a document with DOI
When citing references, you should also cite the DOI if the article has one. If your citation guideline does not include DOIs, you may cite the DOI link.
DOIs allow accurate citations, improve academic contents connections, and allow users to gain better experience across different platforms. Currently, there are more than 70 million DOIs registered for academic contents. If you want to understand more about DOI, please visit airiti DOI Registration ( doi.airiti.com ) 。
A Soft Computing Algorithm for Disassembly Sequencing
林相宇 , Masters Advisor:葉維彰
英文
DOI:
10.6843/NTHU.2009.00097
拆解 ; 間斷型例子群演算法 ; 田口方法 ; Disassembly ; Discrete particle swarm optimization (DPSO) ; Taguchi methods


- [3] D. Navin-Chandra, “The recovery problem in product design” ,Journal of Engineering Design, Vol. 5, 1994, pp. 65–86.
連結: - [4] J. Kennedy, R. C. Eberhart, “Particle swarm optimization” , In Proc.
連結: - IEEE Int. Conf. Neural Networks, Piscataway, November 1995, pp. 1942–1948.
連結: - [5] J. Kennedy, R. C. Eberhart, “A discrete binary version of the particle swarm algorithm” , In Proc. Of IEEE Int. Conf. on Systems, Man and Cybernetics, Vol. 5, No. 12-15, 1997, pp.4104-4108.
連結: - [7] K.-K. Seo, J.-H. Park, and D.-S. Jang, “Optimal disassembly sequence using genetic algorithms considering economic and environmental aspects” , The International Journal of Advanced Manufacturing Technology, Vol. 18, No. 5, 2001, pp. 371–380.
連結: