DOI
stands for Digital Object Identifier
(
D
igital
O
bject
I
dentifier
)
,
and is the unique identifier for objects on the internet. It can be used to create persistent link and to cite articles.
Using DOI as a persistent link
To create a persistent link, add「http://dx.doi.org/」
「
http://dx.doi.org/
」
before a DOI.
For instance, if the DOI of an article is
10.5297/ser.1201.002
, you can link persistently to the article by entering the following link in your browser:
http://dx.doi.org/
10.5297/ser.1201.002
。
The DOI link will always direct you to the most updated article page no matter how the publisher changes the document's position, avoiding errors when engaging in important research.
Cite a document with DOI
When citing references, you should also cite the DOI if the article has one. If your citation guideline does not include DOIs, you may cite the DOI link.
DOIs allow accurate citations, improve academic contents connections, and allow users to gain better experience across different platforms. Currently, there are more than 70 million DOIs registered for academic contents. If you want to understand more about DOI, please visit airiti DOI Registration ( doi.airiti.com ) 。
錫銀銅銲料與無電鍍鎳(磷)/鈀/金底層金屬之微觀結構、可靠度測試及結構方向性
曾建富 , Ph.D Advisor:杜正恭
英文
無鉛銲料 ; 電子封裝 ; 鎳鈀金表面處理 ; 介金屬化合物 ; 微結構觀察 ; 可靠度測試 ; 結構方向性 ; 背向電子繞射儀 ; Pb-free solder ; Electronic packaging ; ENEPIG surface finish ; Intermetallic compound ; Microstructure Evolution ; Reliability Test ; Grain Orientation ; EBSD


- 1. L.F. Miller, “Controlled collapse reflow chip joining.” IBM J. Res. Develop. 13 (1969) 239.
連結: - 4. M.E. Loomans, S. Vaynman, G. Ghosh and M.E. Fine, “Investigation of multi-component lead-free solders.” J. Electron. Mater. 23 (1994) 741.
連結: - 5. A.A. Liu, H.K. Kim, K.N. Tu and P.A. Totta, “Spalling of Cu6Sn5 spheroids in the soldering reaction of eutectic SnPb on Cr/Cu/Au thin films.” J. Appl. Phys. 80 (1996) 2774.
連結: - 6. H.K. Kim, K.N. Tu and P.A. Totta, “Ripening-assisted asymmetric spalling of Cu-Sn compound spheroids in solder joint on Si wafer.” Appl. Phys. Lett. 68 (1996) 2204.
連結: - 7. S.K. Kang, R.S. Rai and S. Purrshothaman, “Interfacial reactions during soldering with lead-tin eutectic and lead (Pb)-free, tin-rich solders.” J. Electron. Mater. 25 (1996) 1113.
連結: