- 學位論文
多層板功率模組於熱循環測試下之壽命預測
Life Prediction of Multi-Layer Power Module Subjected to Thermal Cycling Test
摘要
對於如太陽能電池晶片模組及單閘極絕緣雙接面電晶體(Insulated Gate Bipolar Transistor, IGBT)功率模組等多層板結構而言，如何有效評估其可靠度，並應用於實際產品開發中，是一項重要的課題。與傳統以實驗及試誤法(try and error)進行產品開發相比，以模擬分析方式進行研發，將可大量減少研發時間與經費，並了解結構在週期性負載下之物理行為，此方法逐漸被廣泛使用。然而在分析時所採用的壽命預估模型，需先依據模擬結果並以適當的實驗驗證方能提出。本研究根據高聚光型太陽能電池晶片模組(High Concentrated Photovoltaic, HCPV)的實際測試樣本建立三維有限單元模型(Finite Element Model,FEM)進行模組於熱循環測試下之銲錫力學行為分析，進一步驗證壽命預估模型的合理性。 首先進行高聚光型太陽能電池晶片模組之暫態熱傳分析，將結果與實驗所得的溫度分布比對，以驗證模擬的合理性。接著進行高聚光型太陽能電池晶片模組的熱固分析，發現銲錫除了邊緣的區域以外應力值皆偏低。根據文獻建立另一有限單元模型，以分析其應力/應變分布，趨勢與先前的模型相似。由其最大等效塑性應變值代入壽命預估模型可得出預估壽命，其值小於實驗值，推斷實際模組的銲錫厚度高於假定值。 根據銲錫的等效塑性應變分布，估算其裂紋範圍，並給定負載與強制對流條件，觀察裂紋範圍對整體溫度分布的影響。分析結果指出當破壞裂紋產生時，會影響其熱傳導的特性，使整體封裝溫度上升。
並列摘要
With regards to the multi-layer structure such as solar cell chip module and insulated gate bipolar transistor (IGBT) power module, it is an important issue to estimate its reliability effectively, and apply to the development of actual production. Compare to the traditional accelerated failure experiment, using simulation analysis in research shall save a lot of time and outlay, and the physical behavior of the structure under periodical loading shall be understood. The methodology is progressively, widely used in recent years. However, the life-estimating model should be proposed according to the result of simulation and the verification of applicable experiment. A 3-D finite element model (FEM)was established based on test samples i.e. High Concentrated Photovoltaic (HCPV) module, in this study. The model was subjected to thermal cycling test to analyze the mechanical behavior of solder, and the life prediction model was further validated by the experiment from the literature. First, the transient heat transfer analysis of HCPV module was conducted, and the result was compared to the temperature distribution of the experiment in order to verify the rationality of the FE model. Then the thermal-mechanical analysis of HCPV was performed, and the results reveal that the stress levels at the solder expect for the boundary is very low. Another model was established from the literature to analyze the stress/strain distribution, and the tendency resembles to the prior one. The maximum equivalent strain could be substituted into life prediction model to afford the prediction life, which is smaller than the experimental value. It is inferred that the uniformity of solder thickness will cause larger strain, so the predicted lifetime is smaller than the experiment. The crack front could be estimated by the distribution of the equivalent plastic strain of the solder, then the loading and forced convective condition was given to observe the affection of the delaminating area on the temperature distribution of the whole packaging. The analytical result points out that when the delaminating occurs, the property of conduction will be affected, and the temperature of the whole packaging rises.
參考文獻
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