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Search Symbol (Half-width) Description of Search Symbols
Space "AND" indicates the intertwining of key terms used in a search
Double Quotation Marks ("") ( " " ) Double quotation marks indicate the beginning and end of a phrase, and the search will only include terms that appear in the same order of those within the quotations. Example: "image process" : " image process "
? Indicates a variable letter. Entering two ? will indicate two variable letters, and so on. Example: "Appl?", search results will yield apple, apply… e , appl y … ( (often used to English word searches) )
* Indicates an unlimited number of variable letters to follow, from 1~n. Example: Enter "appl*", search results will yield apple, apples, apply, applied, application…(often used in English word searches) e , appl es , appl y , appl ied , appl ication … ( (often used to English word searches) )
AND、OR、NOT

Boolean logic combinations of key words is a skill used to expand or refine search parameters.
(1) AND (1) AND: Refines search parameters
(2) OR (2) OR: Expands search parameters (3) NOT: Excludes irrelevant parameters

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DOI stands for Digital Object Identifier ( D igital O bject I dentifier ) ,
and is the unique identifier for objects on the internet. It can be used to create persistent link and to cite articles.

Using DOI as a persistent link

To create a persistent link, add「http://dx.doi.org/」 「 http://dx.doi.org/ 」 before a DOI.
For instance, if the DOI of an article is 10.5297/ser.1201.002 , you can link persistently to the article by entering the following link in your browser: http://dx.doi.org/ 10.5297/ser.1201.002
The DOI link will always direct you to the most updated article page no matter how the publisher changes the document's position, avoiding errors when engaging in important research.

Cite a document with DOI

When citing references, you should also cite the DOI if the article has one. If your citation guideline does not include DOIs, you may cite the DOI link.

DOIs allow accurate citations, improve academic contents connections, and allow users to gain better experience across different platforms. Currently, there are more than 70 million DOIs registered for academic contents. If you want to understand more about DOI, please visit airiti DOI Registrationdoi.airiti.com ) 。

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Abstract 〈TOP〉
    Reference ( 69 ) 〈TOP〉
    1. [1] T. Schubert, B. Trindade, T. Weissgarber, and B. Kieback, "Interfacial design of Cu-based composites prepared by powder metallurgy for heat sink applications", Materials Science and Engineering A, 475 (2008) 39-44.
      連結:
    2. [2] G. E. Moore, "Cramming more components onto integrated circuits (Reprinted from Electronics, pg 114-117, April 19, 1965)", Proceedings of The IEEE, 86 (1998) 82-85.
      連結:
    3. [3] Eric Pop, "Energy Dissipation and Transport in Nanoscale Devices", Nano Research, 3 (2010) 147-169.
      連結:
    4. [4] R. Mahajan, Chiu Chia-pin, and G. Chrysler, "Cooling a Microprocessor Chip", Proceedings of the IEEE, 94 (2006) 1476-1486.
      連結:
    5. [9] D. M. Jacobson and S. P. S. Sangha, "Novel Low Expansion Packages for Elecronics", The GEC Journal of Technology, 14 (1997) 48-52.
      連結:
    Times Cited (3) 〈TOP〉
    1. 吳宜馨(2015)。高導熱銅基鑽石複材製造及其基板接合。清華大學材料科學工程學系學位論文。2015。1-170。
    2. 謝孟君(2015)。銀銅基材對鑽石/銀銅-鈦複合材料熱性質之影響。清華大學材料科學工程學系學位論文。2015。1-157。
    3. 錢賢峻(2017)。鑽石銀基複材與基板接合之熱界面材料開發。清華大學材料科學工程學系學位論文。2017。1-134。
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