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  • 學位論文

應用雷射敏感活化粉末材料取代LDS專用材料之研究

Study on the Laser Sensitive Activate Powder for Replacing LDS Proprietary Materials

指導教授 : 鍾文仁

摘要


現今的3C通訊及電子產品的小型化是科技進步的重要趨勢,而運用三維模型互連器件3D-MID (Three Dimensional Molded Interconnect Device)的技術可使電器與機械性能相互結合,並可靈活運用於迴路設計和縮短生產流程的品質與技術更為重要,它主要是利用近紅外光(Near-Infrared,NIR)雷射光和特殊的塑膠材料之間相互反應來建構具有導電性的線路製程,而最常見的尤其以LDS(Laser Direct Structuring)製程為主,但是此專用材料相較昂貴。 LDS製程是由射出成型、雷射光活化、金屬化、組裝等四步驟完成,此研究是找尋相似LDS功能的雷射敏感活化粉末(Laser Sensitive Activate Powder)後,將此粉末混鍊添加於塑膠原料中做均勻的混合,再透過LDS相同的製程的結果研究出取代的可能性。 再運用信賴性條件加以驗證,將以市售的雷雕加工粉末添加於PC塑料做混合,並做成射出成型產品後再用雷雕加工及化鍍沉積方式做出測試的圖形線路,條件是光纖式的雷雕機以光波長1064nm為基礎,而添加配方粉末比例為每公斤的PC塑料中混加40~45g的雷雕粉末,雷雕加工機參數由功率(P):6W、頻率(F):40~55mHz、速度(S):2500mm/sec、雷射光間距(H):45μm,化鍍參數以銅(Cu):8~16μm、鎳(Ni):2~6μm、金(Au)0.05μm,來研究出最佳效果,透過信賴測試有百格測試、高溫高濕、恆溫恆濕來確認並與原有的LDS原料比較,讓材料成本有降低的方案及可能性,藉此成為技術研究的方法與目的。 對於未來可以發展不同特性的高分子材料運用,例如:混合於各種高分子物性、不同的顏色,當使用LDS原材料發生限制時,則此研究的結果可供另一種選擇,可提供電子產業不同的思維及不同工程領域應用。 關鍵字: 3D-MID、NIR、LDS、雷射敏感活化粉末、金屬化、百格測試、高溫高濕、恆溫恆濕。

並列摘要


Miniaturization of 3C communication and electronic product is an important trend in technology. A Technology is using 3D-MID (Three Dimensional Molded Interconnect Device) to combine electrical and mechanical performance of material and it could apply flexibly to design electronic circuit and reduce the production quality and technology of manufacture process. The technology that is by using interaction between NIR (Near-Infrared) laser and special plastics to create the electronic circuit. The most common technology is called LDS (Laser Direct Structuring). But the LDS specialized material cost is expensive. LDS has four processes that are injection molding, Laser activation, Chemical coating and assembly. This report study the Laser Sensitive Activate Powder which performance is similar with the LDS material. It mixed the Laser Sensitive Activate Powder and high polymer material. The material could be applied on LDS manufacture process to get the product which has the same function with LDS product and replace the LDS material. Verify the product by reliability condition. The product is using the material that is mixed Laser Sensitive Activate Powder and PC plastics to create the injection product, then using Laser to activate and chemical deposition to create the test circuit. The base condition is using Fiber Laser Engraving Machine with 1064nm wavelength and using mixed power formulation proportion is 40~45g of Laser Sensitive Activate Powder per kilogram of PC plastic. The optimization manufacture parameter of Laser Engraving Machine are Power (P):6Watt, Frequency (F):40~55mHz,Speed (S):2500mm/sec and distance of the laser light Hatch (H):45μm. the optimization manufacture parameters of chemical deposition are Copper (Cu):8~16μm; Nickel (Ni):2~6μm; Gold (Au):0.05μm.Then test the finished product by adhesion test, High Temperature & High Humidity test and Constant Temperature & Humidity test. Check the result of the product using new material and product using LDS material. The study purpose is to do cost down antenna product or the plastic attach the circuit. It can extent the application of the different performance of high polymer material in the future. For example: Using mixing Laser Sensitive Activate Powder and color or physical properties high polymer material when the LDS material cannot meet the requirement. The study could apply a better choice for different electronics industry or the application on other technical area. Keywords: 3D-MID, NIR, LDS, Laser Sensitive Activate Powder, Metallization, Cross-Cutting test, High Temperature & High Humidity test, Constant Temperature & Humidity test.

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