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  • 學位論文

Driver IC覆晶薄膜基材之剪應力和扭曲品質測試研究

The study on quality test of shear and twist for the Driver IC COF

指導教授 : 黃博滄
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摘要


隨著數位科技時代的來臨及電子科技技術不斷地提升,薄膜電晶體液晶顯示器(Thin Film Transistor-Liquid Crystal Display,TFT-LCD)產業不斷蓬勃發展,新的技術與應用不斷的出現在消費性電子產品(如:FHD(Full High Definition)手機、NB(Notebook)觸控面板及4K2K電視面板…等),這也使得面板產業之間相互的競爭更加激烈,若要在激烈的競爭中脫穎而出,尤其是消費性電子產品,在價格的優勢、新技術開發及產品的生產技術與品質是非常重要的。因此,產品品質績效正確與否,將會左右未來公司之信譽。 本文主要研究使用在TFT-LCD的覆晶薄膜基材(Chip On Film,COF)測試,探討剪應力測試(Shear Test)和扭曲測試(Twist Test),本研究在美國某筆記型電腦大廠和台中科學園區的某上市大型面板公司發生客訴的問題,從發生的異常成像和分析的結果,確認真因是COF的線路斷裂所造成面板的異常,按照目前業界的彎折測試(Bending Test)是無法攔檢出線路斷裂的問題,但經過剪應力測試和扭曲測試可以攔檢出此客訴件的異常問題,所以剪應力測試和扭曲測試可證明其成效。本研究的實驗結果,透過COF加入剪應力測試和扭曲測試的機械強度測試可以提前攔檢出線路斷裂的問題,本研究的實驗結果,在前面敘述兩件實際發生的異常案件,可證明本研究的兩項測試有顯著改善其薄膜基材在材料、製程及設計面的不良,做好事先預防改善,所以將剪應力測試及扭曲測試加入至捲帶供應商(Tape house)的新產品覆晶薄膜基材驗證,提早發現問題,避免在客戶端發生異常。

並列摘要


With coming era of digital technology and advancing electronic technology, the industry of Thin Film Transistor-Liquid Crystal Display (TFT-LCD) has been developed in diversity. New technology and new applications constantly put in use of consuming electronic products (e.g. Full High Definition mobile phone, Notebook touch panel, 4K2K TV display and etc.); therefore, to stand out the fierce competition in TFT-LCD industry, it is important to have price advantage, new technology development and manufacturing technology and quality in products especially in consuming electronic products. Product quality validity will have a great influence on company future reputation. The theory is to study shear test and twist test applied to Chip on Film (COF) in TFT-LCD. One US customer and one large TFT-LCD company both complaint TFT-LCD quality issue mentioned in the study, from the defect phenomenon and failure analysis result, it is confirmed the root cause resulted from lead line crack on COF, which cannot be effectively detected by bending test which is comprehensively used in the industry; however, it could effective detect the problem by shear test and twist test. From the results, it finds that shear test and twist test could early detect lead line crack problem on the substrate of COF. From the result of the study, it demonstrates shear test and twist test could easily detect lead line crack and contribute quality improvement as prevention in the perspective of thin film substrate material, layout pattern design and manufacturing. It is suggested to introduce shear test and twist test to the vendors of tape house for new product verification on thin film substrates as early detection and prevention quality issue from occurrence in customers.

並列關鍵字

Twist test TFT-LCD Driver IC COF Shear test

參考文獻


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