環氧樹脂奈米複合材料及孔洞性材料之製備與性質探討

Preparation and Property Studies of Epoxy Resin Nanocomposite Materials and Epoxy Resin Porous Materials

戴崇峰(Chung-Feng Dai)

指導教授 ： 葉瑞銘

中原大學/理學院/化學研究所/碩士(2006年)

https://doi.org/10.6840/cycu200600415

摘要

在本論文中，主要著重於環氧樹脂在奈米複合材料的應用探討，以及環氧樹脂在孔洞性材料領域的發展與性質研究。 並分為下面兩個部份︰
第一部分，研究兩種改質型黏土在環氧樹脂基材中造成插層或脫層分散效果的不同。 材料製備是採用三個環氧官能基的環氧樹脂與T-403進行典型的開環加成反應，而改質型黏土則是採用原位 (in-situ) 聚合方式均勻分散在基材中，形成環氧樹脂／蒙脫土奈米複合材料並做一系列的防腐蝕能力、氣體阻隔特性、熱穩定性、耐燃性質和機械強度等測試。 由於Φ3P+-C12改質型黏土在環氧樹脂基材中具有好的分散性，相對於Me3N+-C16改質型黏土而言，可以提高環氧樹脂複合材料的氣體阻隔特性 (例如︰水氣與氧氣)，進一步提升TECP系列(環氧樹脂與Φ3P+-C12改質型黏土奈米複合材料)的防腐蝕能力、阻隔特性、熱穩定性、耐燃性質和機械強度。
第二部份，針對環氧樹脂發展成為孔洞材料的研究。 雖然環氧樹脂具有非常高的功能性且在阻隔材料的應用性上扮演重要的角色，但高介電值 (3.8〜4.5) 的缺點為環氧樹脂所擁有，這是高效能塑膠材料必須克服的。 根據文獻指出，具有孔洞性材料可以降低材料的介電常數，因為基材中的空穴存在著介電常數1的空氣。 本研究概念源自於「溶劑鑄造鹽洗法」與「分子模印技術」，利用模板分子poly(ethyl glycol), PEG添加於環氧樹脂中，當環氧樹脂進行開環聚合後再將PEG運用萃取方式取出而得到具有孔洞性的環氧樹脂。 由介電測試得知，其介電常數隨著孔洞數目增加而降幅從4.11至2.89，此外，介電損失也因孔洞出現下降到0.03，這現象似乎說明此孔洞材料擁有「絕電」的能力。 另一方面，“阻隔”是一種特性，可以用來解釋物質 (例如光、電、熱…等) 穿透行為受到隔絕的程度。 先從材料外觀來看，由一透明塊材歷經萃取後轉變為光線無法通過的基材，利用反射式UV結果了解，當孔洞存在於材料中可以降低其透光度，因此在隔絕光線是不錯的應用。 在熱傳導測試數據可以分析，熱傳導與熱擴散特性同樣隨著孔洞數目增加而減弱，這項特質將把孔洞性環氧樹脂發展成為一個好的隔熱材料。

關鍵字

熱傳導特性 ； 孔洞材料 ； 介電特性 ； 防腐蝕 ； 奈米複合材料 ； 黏土 ； 耐燃 ； 環氧樹脂

並列摘要

Epoxy resin is widely used as matrix materials for fabrication of the advanced composites in the electrical/electronic industry, owning to their high tensile strength and modulus, good adhesive properties, good chemical and corrosion resistance, low shrinkage in cure, and excellent thermal and dimensional stability. As we known, it is one of the most-used synthetic resins today. In this research, we will focus on preparation and property of epoxy resin (Triphenylolmethane triglycidyl ether, TGTPM) nanocomposite materials and epoxy resin porous materials. This essay is divided into two parts.
In the first part, epoxy resin nanocomposite materials studies on two types of intercalated or/and exfoliated silicate platelets were allowed to disperse in tri-functional epoxy matrix cured tri-functional amine hardener (T-403) followed by a typical ring opening polymerization. The different dispersing forms of these silicate platelets by in situ along with the PCN materials may alter their gas barrier, thermal stability, mechanical strength, and fire retardant properties. The Φ3P+-C12-modified clay PCN materials showed superior corrosion protection compared to Me3N+-C16-modified when tested for performance in series of electrochemical measurements of corrosion protection, polarization resistance, corrosion current and impedance spectroscopy. At the same time, molecular (e.g. O2 and H2O) permeability results also support the products of electrochemical measurements. Heat-distortion, and dynamic mechanical properties were also investigated the difference between both PCN materials (TECP system and TECN system). The results of TECP system owns high glass transition temperature and mechanical behavior were found by DSC, DMA. Moreover, thermal stability and flame retardant properties were evaluated, and TECP system exhibits high results. The TGA, and LOI shall identity, respectively.
The second part, epoxy resin porous materials will be researched. High performance epoxy resin plays an important role as insulating materials in manufacturing components. In order to increase the application of epoxy resin, some drawbacks associated with epoxy networks like high dielectric constant values (3.8-4.5) must overcome. And a porous structure can make it. In this case, the epoxy resin of micro- / macro- voids were formed in poly(ethyl glycol), PEG, which was according to “solvent-casting particulate leaching” and “molecularly imprinting polymer”. The cavitation is later established, when PEG is extracting, leaving behind empty pores. As a result, a reduction in dielectric constant from 4.11 to 2.89 is realized simply by replacing the polymer with air which has a dielectric constant of 1. At the same time, the value of dielectric loss decreased to 0.03. The phenomenon shows that epoxy resin porous material has an ability of “electrical/electronic damping” indistinctly. Furthermore, permeability is a property which defines the resistance to the penetration of aggressive substance, such as light, electron, heat…etc. The first difference on appearance transfers from clear to opaque. The epoxy resin with its pores structure, showed a high R% and low permeability values which are measured by UV-vis of R%. This result means the porous material can stop the sunlight, and might be a well divided material. On the other hand, a lowering of thermal transport properties (e.g. thermal conductivity and thermal diffusivity) which investigates by transient plane source (TPS) technique. The report also shows obviously a reduction in thermal transport properties of porous epoxy resin, that attributed to the incorporation of air exists into matrix. Effects of those abilities on porous epoxy resin were done an excellent adiabatic material.

並列關鍵字

Corrosion ； Flame resistance ； Thermal conductivivty. ； Epoxy resin ； Clay ； Nanocomposite ； Dielectric property ； Porous material ； Thermal property

參考文獻

81. 許蘇文, 成大化工所論文, 高頻基板用低介電材料PPO樹脂之合成。

40. 陳啟倫, 中原大學化學系博士學位論文, 2005。

80. 張光欽, 中原大學化學系碩士學位論文, 2004。

6. 黃琇嫈, 中原大學化學系碩士學位論文, 2003。

56. 秦治平, 中原大學化學系碩士學位論文, 2002。