不同微流道形狀散熱器性能之數值研究

陳玉新

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不同微流道形狀散熱器性能之數值研究

Numerical Study on the Heat Sink Performance of Microchannels with Different Channel Shapes

陳玉新 , Ph.D　　Advisor：張耀仁　　

英文

通道形狀；通道長度；散熱器；多噴嘴式微通道散熱器；熱阻抗；溫度均勻性； Channel shapes ； channel length ； heat sink ； multi-nozzle microchannel heat sink ； thermal resistance ； temperature uniformity

Abstract │ Reference (53) │ Altmetrics

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The present study was carried out by three different parts. In the first part: a novel multi-nozzle microchannel heat sink (MN-MCHS) was proposed. The channel length, channel aspect ratio, rib width, pumping power, and heat flux were numerically investigated in detail. It was found that the MN-MCHS with a shorter channel length not only could significantly improve the temperature uniformity on the bottom wall and thermodynamic performance index, but it also could significantly reduce the overall thermal resistance. 
With the decrease in the channel length from 10 mm to 1 mm, the temperature uniformity was enhanced by approximately 10 times, the overall thermal resistance improved 62% and the pressure drop was reduced approximately 12 times. For all cases in the first part, an optimal structure of the MN-MCHS could dissipate a heat flux up to 1300 W/cm2, and kept the temperature rising above the inlet coolant temperature under 77.5oC. In addition, at the same pumping power, it could improve the overall thermal resistance up to 62% and 47.3% compared to that of the single layer MCHS and the double layer MCHS, respectively. This structure of MN-MCHS is really a promising structure of MCHS because it can improve thermal performance and reduce the pressure drop by optimizing its geometric dimensions. 
	In the second part: a copper plate measuring 9.8 mm × 9.8 mm × 0.5 mm was used as a fixed substrate for designs with single-layer-parallel microchannel heat sink (SL-P-MCHS) and MN-MCHS. Water was applied as the coolant. Channel lengths from 0.2 to 5.6 mm, and five different channel shapes, including a circle, square, trapezium, two concave surfaces, and two convex surfaces, were numerically investigated in detail at a constant hydraulic diameter of 200 µm and a Reynolds number in the range of 700 to 2200. 
	A novel scheme for meshing is proposed. A structure for a multi-nozzle microchannel heat sink is presented. For all cases in this part, it was found that the best thermal performance was achieved with a circular channel shape which could dissipate a heat flux up to 1500 W/cm2, and the maximum temperature was kept at less than 75oC at a Reynolds number of 2200. Furthermore, novel equations were proposed to predict the temperature differences between inlet and outlet coolant temperatures depending on the channel length and Reynolds number, as well as to predict the maximum temperatures on the bottom walls of the circular channel shape depending on the Reynolds number and heat flux.
In the third part: a unit cell, with a width of 100 µm, a length of 2 mm, and a height of 500 µm, was used as a fixed computational model for analysis. The computational model included a channel and substrate. Water and Silicon were utilized as the coolant and substrate’s material, respectively. A fixed heat flux of 750 W/cm2 was applied on the model’s bottom wall. To examine the effects of channel depth on the temperature uniformity of the heat sink’s bottom wall, different fixed channel depths of 100 µm to 400 µm, and increasing channel depths from 100 µm to 400 µm along the channel length were investigated in detail. For all cases in this part, it was found that channel depth plays a very important role in controlling temperature uniformity on the heat sink’s bottom wall. The increasing channel depth along the channel length could improve the temperature uniformity up to 36.7 % compared to that of a fixed channel depth.

Reference ( 53 ) 〈TOP〉

[1] D. B. Tuckerman and R. F. W. Pease, "High-Performance Heat Sinking for VLSI," IEEE Electron Device Letters, vol. EDL-2, pp. 126-129, 1981.
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[2] S. U. S. Choi and a. J. A. Eastman, "Enhance thermal conductivity of Fluids with Nanoparticles," ASME International Mechanical Engineering Congress & Exposition, pp. 12-17, 1995.
連結：
[3] K. Vafai and a. L. Zhu, "Analysis of two-layered micro-channel heat sink concept in electronic cooling," International Journal of Heat and Mass Transfer, vol. 42, pp. 2287-2297, 1999.
連結：
[4] C. Leng, X.-D. Wang, and T.-H. Wang, "An improved design of double-layered microchannel heat sink with truncated top channels," Applied Thermal Engineering, vol. 79, pp. 54-62, 2015.
連結：
[5] L. Boteler, N. Jankowski, P. McCluskey, and B. Morgan, "Numerical investigation and sensitivity analysis of manifold microchannel coolers," International Journal of Heat and Mass Transfer, vol. 55, pp. 7698-7708, 2012.
連結：

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