IC封裝模具模穴圓角對於EMC間黏著效應的影響

葉佳循

3.232.133.141，Hello！

Close
Search Quick Search Advanced Search Publication Search	Personal Service Member Login Searching History Use Bonus Card SYMSKAN
Browse Browse by University of Graduate Thesis Browse by Pinyin of Graduate Thesis Browse by Conference Proceedings Topic Browse by Conference Proceedings Publisher Browse by Pinyin of Conference Proceedings Browse by eBook Category Browse by eBook Topic Browse by eBook Publisher
Customer Services Authorize Airiti Recommend a Journal

Search Symbol (Half-width)	Description of Search Symbols
Space	"AND" indicates the intertwining of key terms used in a search
Double Quotation Marks ("") ( " " )	Double quotation marks indicate the beginning and end of a phrase, and the search will only include terms that appear in the same order of those within the quotations. Example: "image process" ： " image process "
?	Indicates a variable letter. Entering two ? will indicate two variable letters, and so on. Example: "Appl?", search results will yield apple, apply… e , appl y … ( (often used to English word searches) )
*	Indicates an unlimited number of variable letters to follow, from 1~n. Example: Enter "appl*", search results will yield apple, apples, apply, applied, application…(often used in English word searches) e , appl es , appl y , appl ied , appl ication … ( (often used to English word searches) )
AND、OR、NOT	Boolean logic combinations of key words is a skill used to expand or refine search parameters. (1) AND (1) AND: Refines search parameters (2) OR (2) OR: Expands search parameters (3) NOT: Excludes irrelevant parameters

DOI stands for Digital Object Identifier （ D igital O bject I dentifier ） ,
and is the unique identifier for objects on the internet. It can be used to create persistent link and to cite articles.

Using DOI as a persistent link

To create a persistent link, add「http://dx.doi.org/」「 http://dx.doi.org/ 」 before a DOI.
For instance, if the DOI of an article is 10.5297/ser.1201.002 , you can link persistently to the article by entering the following link in your browser: http://dx.doi.org/ 10.5297/ser.1201.002 。
The DOI link will always direct you to the most updated article page no matter how the publisher changes the document's position, avoiding errors when engaging in important research.

Cite a document with DOI

When citing references, you should also cite the DOI if the article has one. If your citation guideline does not include DOIs, you may cite the DOI link.

DOIs allow accurate citations, improve academic contents connections, and allow users to gain better experience across different platforms. Currently, there are more than 70 million DOIs registered for academic contents. If you want to understand more about DOI, please visit airiti DOI Registration （ doi.airiti.com ）。

Data Source

College of Engineering > Department of Engineering Science
Engineering > General Engineering

Bibliography Management Tool

Related Links

Report an Issue

Search in Library

There is no full-text available at the moment. Airiti would like to request author's authorization. I would like to provide authorization.

IC封裝模具模穴圓角對於EMC間黏著效應的影響

On Mold Corner Effects of EMC Adhesion for IC Encapsulation Process

葉佳循 , Masters　　Advisor：李輝煌　　

繁體中文

IC封裝；黏著效應；黏模力特性曲線；模穴圓角；圓角效應； IC package ； Adhesion effects ； Cavity fillet ； Corner effect

Abstract │ Reference (40) │ Times Cited (3) │ Altmetrics

Abstract 〈TOP〉

Parallel Abstract 〈TOP〉

In the IC packaging process, epoxy molding compound (EMC) was filling the mold cavity and cured in the mold.  At the same time, adhesion may occur in the interface between the surface of mold and cured EMC.  Large adhesion force could cause many problems, which may influence the ejection process.  Some other critical problems may also happen in the IC molding process if adhesion problem occurs, such as distortion or crack on ejecting finished parts, residue of cured EMC on the surface of mold affecting the quality of the products, and regular, tedious and not effective mold cleaning.  So how to improve the mold adhesion force effectively is an important issue for industry and research institutes.  To avoid the mold adhesion problems, improving the mold design and applying suitable surface treatments such as mold surface coating are the common approaches.  Among these, applying suitable surface coating is a more popular and practical approach.
This study described the approach of using a semi-automatic EMC adhesion force test instrument to measure adhesion force between the mold surface and EMC and studied the corner effect during the encapsulation process.  Three different cavity arcs were designed in three specimens and molded and tested during molding to observe the corner effects.  Engineers could determine the best type of surface treatment and the type of corner to reduce the amount of mold adhesion force.  This paper also discussed the issue of successive adhesion force test and the variation of adhesion force during successive molding test to predict the time for mold cleaning.  It was found that adhesion force was an effective parameter to predict the performance of an IC encapsulation mold in terms of adhesion.

Reference ( 40 ) 〈TOP〉

[1] A. C. Loos and G. S. Springer, “Curing of Epoxy Matrix Composites,” Journal of Composite Materials, Vol. 17, No. 2, pp. 135-169, 1983.
連結：
[2] G. S. Springer, “Resin Flow During the Cure of Fiber Reinforced Composites,” Journal of Composite Materials, Vol. 16, No. 5, pp. 400-410, 1982.
連結：
[3] U. F. González, S. F. Shen, and Claude Cohen, “Rheological Characterization of Fast-Reacting Thermosets Through Spiral Flow Experiments,” Polymer Engineering and Science, Vol. 32, No. 3, pp. 172-181, 1992.
連結：
[4] R. L. Frutiger, “The Effect of Flow on Cavity Surface Temperatures in Thermoset and Thermoplastic Injection Molding,” Polymer Engineering and Science, Vol.26, No. 3, pp. 243-254, 1986.
連結：
[5] C. C. Lee and C. L. Tucker III, “Flow and Heat Transfer in Compression Mold Filling,” Journal of Non-Newtonian Fluid Mechanics, Vol. 24, No. 3, pp. 245-264, 1987.
連結：

Times Cited (3) 〈TOP〉

Altmetrics

〈TOP〉

E-mail ：

When an article is available to download, a notice will be sent to your mailbox address.

E-mail ：