DOI
stands for Digital Object Identifier
(
D
igital
O
bject
I
dentifier
)
,
and is the unique identifier for objects on the internet. It can be used to create persistent link and to cite articles.
Using DOI as a persistent link
To create a persistent link, add「http://dx.doi.org/」
「
http://dx.doi.org/
」
before a DOI.
For instance, if the DOI of an article is
10.5297/ser.1201.002
, you can link persistently to the article by entering the following link in your browser:
http://dx.doi.org/
10.5297/ser.1201.002
。
The DOI link will always direct you to the most updated article page no matter how the publisher changes the document's position, avoiding errors when engaging in important research.
Cite a document with DOI
When citing references, you should also cite the DOI if the article has one. If your citation guideline does not include DOIs, you may cite the DOI link.
DOIs allow accurate citations, improve academic contents connections, and allow users to gain better experience across different platforms. Currently, there are more than 70 million DOIs registered for academic contents. If you want to understand more about DOI, please visit airiti DOI Registration ( doi.airiti.com ) 。
邱䕒僾 , Masters Advisor:謝克昌
繁體中文
打線製程 ; 銅線鋁墊微接點 ; 擴散偶 ; 相圖 ; Al-Cu-Pd三元系統 ; the Al-Cu-Pd ternary system ; mic-contact of Cu-wire and Al-pad ; wire-bonding process ; diffusion couple ; phase diagram


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連結: - [5] Y. Funamizu and K. Watanabe , “ Interdiffusion in the Al-Cu System” , Trans. Jpn. Inst. Met. ,vol. 12 , (1971) .
連結: - [6] H. Xu , C. Q. Liu , V. V. Silberschmidt and Z. Chen , “Growth of Intermetallic Compounds in Thermosonic Copper Wire Bonding on Aluminum Metallization”, Journal of Electronic Materials , vol. 39, no. 1, (2010) .
連結: - [7] William D. Callister , “Materials Science and Engineering : An Introduction” 7th Ed. , John Wiley & Sons Inc. ,(2007) .
連結: - [8] F. W. Sears , M. W. Zemansky and H. D. Young ,“University Physics” 7th Ed. , Addison-Wesley Pub. Co. , (1987) .
連結: