銅合金線可靠度及Al-Cu-Pd相圖研究

邱䕒僾

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銅合金線可靠度及Al-Cu-Pd相圖研究

The Reliability Study of Cu Alloy Wire in Wire-bonding Process and the Study of Al-Cu-Pd Phase Diagram

邱䕒僾 , Masters　　Advisor：謝克昌　　

繁體中文

打線製程；銅線鋁墊微接點；擴散偶；相圖； Al-Cu-Pd三元系統； the Al-Cu-Pd ternary system ； mic-contact of Cu-wire and Al-pad ； wire-bonding process ； diffusion couple ； phase diagram

Abstract │ Reference (50) │ Altmetrics

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Wire bonding is a widely used method in electronic package, which gold wire bonds to aluminum pad to form the I/O joints. Because of the price of gold is high, many alternative materials have been studied to replace gold wire. Copper wire has the low price, better electrical conductivity and thermal conductivity than gold wire, copper wire has been selected as a alternative material. But copper is prone to oxidation in the process, a palladium protective layer coated on the surface of copper wire. 
This study investigates the growth of intermetallic phases (IMCs) and crack formation of copper wire and palladium-coated copper wire under high temperature aging from 500 hrs to 2000 hrs at 175 oC and 205 oC. We found that the IMCs and crack of palladium-coated copper wire grew slowly. Coating palladium on the surface of copper can indeed slightly increase the reliability of the I/O joints. In addition, the growth rate of IMCs slowed down with aging time, and the thickness wouldn’t increase after the consumption of the aluminum pad. 
The lack of information about the Al-Cu-Pd ternary system in literature, the second part of this study is the Al-Cu-Pd ternary phase diagram determination at 500oC.We used diffusion couple method instead of traditional equilibrated bulk alloys to determine the phase relations. There are four ternary phases and ten three-phase equilibria were determined in the Al-Cu-Pd ternary equilibrium phase diagram at 500oC.

Reference ( 50 ) 〈TOP〉

[4] J.S. Kirkaldy , “Diffusion in Multicomponent Metallic Systems” , Can. Journal of Physics , vol.36 , p. 917 , (1958) .
連結：
[5] Y. Funamizu and K. Watanabe , “ Interdiffusion in the Al-Cu System” , Trans. Jpn. Inst. Met. ,vol. 12 , (1971) .
連結：
[6] H. Xu , C. Q. Liu , V. V. Silberschmidt and Z. Chen , “Growth of Intermetallic Compounds in Thermosonic Copper Wire Bonding on Aluminum Metallization”, Journal of Electronic Materials , vol. 39, no. 1, (2010) .
連結：
[7] William D. Callister , “Materials Science and Engineering : An Introduction” 7th Ed. , John Wiley & Sons Inc. ,(2007) .
連結：
[8] F. W. Sears , M. W. Zemansky and H. D. Young ,“University Physics” 7th Ed. , Addison-Wesley Pub. Co. , (1987) .
連結：

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