DOI
stands for Digital Object Identifier
(
D
igital
O
bject
I
dentifier
)
,
and is the unique identifier for objects on the internet. It can be used to create persistent link and to cite articles.
Using DOI as a persistent link
To create a persistent link, add「http://dx.doi.org/」
「
http://dx.doi.org/
」
before a DOI.
For instance, if the DOI of an article is
10.5297/ser.1201.002
, you can link persistently to the article by entering the following link in your browser:
http://dx.doi.org/
10.5297/ser.1201.002
。
The DOI link will always direct you to the most updated article page no matter how the publisher changes the document's position, avoiding errors when engaging in important research.
Cite a document with DOI
When citing references, you should also cite the DOI if the article has one. If your citation guideline does not include DOIs, you may cite the DOI link.
DOIs allow accurate citations, improve academic contents connections, and allow users to gain better experience across different platforms. Currently, there are more than 70 million DOIs registered for academic contents. If you want to understand more about DOI, please visit airiti DOI Registration ( doi.airiti.com ) 。
Development of Electrochemical Deposition for Extra-fine Pitch Micro Lead-free Solder Bumps
黃冠傑 , Masters Advisor:吳樸偉;林鵬
繁體中文
DOI:
10.6842/NCTU.2011.00833
無鉛銲錫 ; 電化學 ; 電鍍 ; 凸塊下金屬層 ; Solder bump ; Electrochemistry ; Electroplating ; UBM


- [3] A. Yu, A. Kumar, S.W. Ho, H.W. Yin, John H. Lau. Development of Fine Pitch Solder Microbumps for 3D Chip Stacking, 10th Electronics Packaging Technology Conference. 2008.
連結: - [5] USP 3,648,131 by International Business Machines Corporation. 1969.
連結: - [6] X. Lin and L. Luo. Sub-100 µm SnAg Solder Bumping Technology and the Bump Reliability. J. Electron. Packag. 2009;131:011014.
連結: - [9] S. Bader, W. Gust and H. Hieber. Rapid Formation of Intermetallic Compounds Interdiffusion in the Cu-Sn and Ni-Sn Systems. Acta Metall. Mater. 1995;43:329.
連結: - [10] R.S. Rai. S.K. Kang and S. Purushothaman, Proc. 45th Electronic Components &Technology Conference. 1995:1197.
連結: