In this study, a Cu/Ni UBM and lead-free solder for 20 μm pitch micro-bump has been attempted to fabricate via consecutive electroplating of Cu, Ni and binary SnAg in specification on a patterned wafer. The targeted thickness of Cu and Ni are 5 μm and 3 μm for the preparation of UBM, and the thickness of the SnAg solder bump is 5 μm with 2.5 wt% Ag composition. After the electroplating process, the solder undergoes a reflow process to obtaining spherically-shaped bumps. Electron Probe Micro-analyzer (EPMA) is carried out to evaluate relevant material properties. We observe a strong effect for the plating current density on the resulting bump morphologies. After adjusting relevant parameters, the formation of 5 μm Cu/3 μm Ni/5 μm Sn-2.5 wt% Ag bumps can be successfully fabricated, and the spherically-shaped solder balls are confirmed with composition variation within 0.2 wt% deviation.