DOI
stands for Digital Object Identifier
(
D
igital
O
bject
I
dentifier
)
,
and is the unique identifier for objects on the internet. It can be used to create persistent link and to cite articles.
Using DOI as a persistent link
To create a persistent link, add「http://dx.doi.org/」
「
http://dx.doi.org/
」
before a DOI.
For instance, if the DOI of an article is
10.5297/ser.1201.002
, you can link persistently to the article by entering the following link in your browser:
http://dx.doi.org/
10.5297/ser.1201.002
。
The DOI link will always direct you to the most updated article page no matter how the publisher changes the document's position, avoiding errors when engaging in important research.
Cite a document with DOI
When citing references, you should also cite the DOI if the article has one. If your citation guideline does not include DOIs, you may cite the DOI link.
DOIs allow accurate citations, improve academic contents connections, and allow users to gain better experience across different platforms. Currently, there are more than 70 million DOIs registered for academic contents. If you want to understand more about DOI, please visit airiti DOI Registration ( doi.airiti.com ) 。
A study on the Electrophoretic deposition assisted bamboo carbon polishing effect
彭國芳 , Masters Advisor:顏炳華
繁體中文
搖擺. ; 表面粗糙度 ; 拋光 ; 多孔性 ; 電泳沉積 ; 竹碳 ; electrophoretic deposition ; bamboo carbon ; porosities ; polishing ; surface rounghness ; rocking.


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連結: - 2.Y. Yamamoto, H. Maeda, H. Shibutani, H. Suzuki and O. Horiuchi, A study on constant-pressure grinding with EPD pellets, Key Engineering Materials, Vol.257-258, pp.135-140, 2004.
連結: - 10.T. Oshita, Y. Sawaki, M. Kishimoto, Grinding performance of pellet prepared using nanosize ceria particles, Journal of Alloys and Compounds, Vols.408-412, pp.1118-1122, 2006.
連結: - 11.N. Kobayashia, Y. Wub and M. Nomurab, Precision treatment of silicon wafer edge utilizing ultrasonically assisted polishing technique, Journal of Materials Processing Technology, Vol.201, pp.531-535, 2007.
連結: - 12.A. Q. Biddut, L. C. Zhang, Y. M. Alia, “Damage-free polishing of monocrystalline silicon wafers without chemical additives”, Scripta Materialia, Vol.59, pp.1178-1181, 2008.
連結: