電泳沉積輔助竹碳拋光效果之研究

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電泳沉積輔助竹碳拋光效果之研究

A study on the Electrophoretic deposition assisted bamboo carbon polishing effect

彭國芳 , Masters　　Advisor：顏炳華　　

繁體中文

搖擺. ；表面粗糙度；拋光；多孔性；電泳沉積；竹碳； electrophoretic deposition ； bamboo carbon ； porosities ； polishing ； surface rounghness ； rocking.

Abstract │ Reference (17) │ Times Cited (2)

Abstract 〈TOP〉

Parallel Abstract 〈TOP〉

For many years, Precision micro-machining is the focus of development in machinery industry. Number of scholars had already broken through the traditional processing technology. They used Electrophoretic deposition (EPD) method to do polishing experiments, and they had specific results. But how to improve more efficiency and quality of polishing, that is the next subject what we have to research. This experiment objective is continue to use self-developed bamboo carbon polishing spindle which can be control rotary speed ,and which installed to the grinding equipment. by electrophoretic deposition to assist the bamboo carbon to achieve mirror-polished to enhance the effects of mirror-polished silicon wafer, the surface of specimen were measured and observed. Moreover, and then the parameters that affect quality were analyzed and discussed. The slurry in this experiment each adds powder of SiC and Diamond. Use porosities and bigger specific surface area advantages of bamboo carbon, and has polish let the abrasive transport to bamboo carbon grinding side by the two-phase fluid type. The numbers of experiment have slurry concentration, time, load, spindle speed and polishing plate speed act. When the bamboo carbon push on the workpiece surface, the abrasive will grinding, And because the bamboo carbon surface collapsed, Resulting recycled and self-sharpening effectiveness, and continuous on the workpiece surface repeatedly machining, to raise the polishing effect. The experimental results confirmed, bamboo carbon were in the silicon wafer regeneration machining process, assisted by electrophoretic deposition, can accelerate the reduction of silicon surface roughness and improve the efficiency. No matter what the polishing abrasive is powder of SiC or Diamond, it can use the rocking function can significantly remove machining marks in the machining process. And improvement the surface rounghness of silicon wafer in fast, also can have result of mirror reflection in quickly.
Keywords: electrophoretic deposition, bamboo carbon, porosities, polishing, surface rounghness, rocking.

Reference ( 17 ) 〈TOP〉

1.J. Hopenfeld, R.R. Cole, Prediction of the one-dimensional equilibrium cutting gap in electrochemical machining, Transaction of ASME J. Eng. Ind., Vol.91, pp.764-765, 1969.
連結：
2.Y. Yamamoto, H. Maeda, H. Shibutani, H. Suzuki and O. Horiuchi, A study on constant-pressure grinding with EPD pellets, Key Engineering Materials, Vol.257-258, pp.135-140, 2004.
連結：
10.T. Oshita, Y. Sawaki, M. Kishimoto, Grinding performance of pellet prepared using nanosize ceria particles, Journal of Alloys and Compounds, Vols.408-412, pp.1118-1122, 2006.
連結：
11.N. Kobayashia, Y. Wub and M. Nomurab, Precision treatment of silicon wafer edge utilizing ultrasonically assisted polishing technique, Journal of Materials Processing Technology, Vol.201, pp.531-535, 2007.
連結：
12.A. Q. Biddut, L. C. Zhang, Y. M. Alia, “Damage-free polishing of monocrystalline silicon wafers without chemical additives”, Scripta Materialia, Vol.59, pp.1178-1181, 2008.
連結：

Times Cited (2) 〈TOP〉

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