抗電磁波之無電鍍銀/Nylon複合材料之製備與研究

Preparation and Investigation of Electroless Plating Silver on Nylon 6 for EMI Shielding

簡碩宏(Shuo-Hung Chien)

指導教授 ： 黃繼遠

大同大學/工程學院/材料工程學系所/碩士(2007年)

摘要

本研究利用無電電鍍法(化學鍍法) 製備鍍銀聚醯胺(耐隆)薄膜，耐隆進行無電之鍍銀前需先進行膨潤、碘處理、敏化、活化之預處理，以達到將銀顆粒析鍍於耐隆薄膜之分子鏈間或表面之目的。耐隆薄膜藉由無電之鍍銀形成之高分子表面金屬複合材料，可達到電磁波遮蔽之效果。
無電電鍍過程中，碘處理及膨潤預處理是影響銀鍍層與基材間吸附性之兩大關鍵。同時針對超音波振盪及磁石攪拌之不同，無電電鍍方法影響電磁波遮蔽效果作探討，此外以SEM、FE-SEM、DSC、XRD、EDS、百格試驗等分析，探討表面及橫截面之型態、熱分析、結晶性、鍍層元素分析、析鍍時間之重量變化、吸附性質測試等等，來解析高分子複合材料之電磁波遮蔽效果變化。
實驗結果顯示，不同的無電電鍍方法會造成不同的電磁波遮蔽效果；利用磁石攪拌方法進行無電電鍍製備之無電鍍銀耐隆，其電磁波遮蔽值為25~30dB，而利用超音波振盪方法進行無電鍍製備之無電鍍銀耐隆，電磁波遮蔽值可以達到約50dB~55dB。EDS之元素分析測試耐隆表面之鍍層為純銀，因其高導電性質而有助於電磁波遮蔽之效果。經由百格試驗之吸附性測試及SEM表面鍍層觀察，相較於只有膨潤處理之預處理，加上碘處理過程，可以使無電電鍍銀大幅提升耐隆與銀鍍層間之吸附性質。另外由SEM表面鍍層型態之觀察，發現隨著析鍍時間之增加，表面銀鍍層之顆粒有堆疊之情形，且隨著析鍍時間增加，銀顆粒間越顯緻密，粒徑最小可達1μm ~3μm。經由DSC 及XRD之分析發現，相較於純耐隆，膨潤處理與碘處理會使結晶構造產生明顯變化。由電磁波遮蔽測試發現，其遮蔽值隨著還原劑(KBr)的增加而增加，在相同析鍍時間(1小時)下，KBr添加並在0.052克時可以達到最佳遮蔽效果。

關鍵字

抗電磁波遮蔽 ； 無電鍍

並列摘要

In this investigation, the electroless Ag polyamide (Nylon) was produced by electroless plating. Nylon must be pretreated (swelling, Iodinate, sensitize, activation) before electroless plating, then electroless silver method was used to plate the silver in the chain or surface of Nylon film. The electromagnetic interference (EMI) shielding effectiveness (SE) of Ag-Nylon composition would achieved by the silver plating of appearance.
In electroless process, pretreatment of Iodinate and swelling were chosen as key point as affections of adhesion between matrix and silver plating. Meanwhile, the influences of electroless method between ultrasonic vibration and magnetic stirring for electromagnetic interference (EMI) shielding effectiveness (SE) were investigated. Additionally, weight analysis of deposition time, surface morphology, adhesion test, thermal properties, elements of plating of polymeric composites were detected by SEM, FE-SEM, DSC, XRD, EDS, EMI measurements, respectively.
The results revealed that different electroless method would obtain different EMI shielding effectiveness. The EMI shielding effectiveness of Ag-Nylon composite would reach about 25~30dB when using electroless method of magnetic stirring, however, the EMI shielding effectiveness of composite would reach 50~55dB when using electroless method of ultrasonic vibration. EDS shows the element analysis of plating was simple Ag that has higher electric conductivity was about 63.01 × 106 S/m.
Adhesion testing and surface morphology of SEM show that pretreatment of Iodinate Nylon would improve adhesion between silver plating and Nylon matrix. Electroless silver process without pretreatment of iodinate, swelling would not obtain better adhesion. SEM analysis shows that stacking silver particles would increase on the surface of Nylon when the deposition time was increased. Agglomeration of silver particles would densely packed with increasing deposition time and the smallest silver particles were observed about 1 to 3μm. DSC and XRD analysis show that Nylon would obtain different crystalline structure after pretreatment of swelling and iodinate. The EMI shielding effectiveness of electroless silver Nylon would increase with increasing the content of KBr, and the highest dB value (55~60dB) would obtain by adding 0.052g of KBr.

並列關鍵字

Electroless plating ； EMI Shielding

參考文獻

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