擴散接合製程條件對Cu-Al2O3 基板剝離強度之影響

The peel strength of copper-bonded alumina substrates prepared by physical and chemical oxidation method

呂耿成(Keng-cheng Lu)

指導教授 ： 吳溪煌

大同大學/工程學院/材料工程學系所/碩士(2009年)

摘要

以物理法，化學法在銅箔上進行預先氧化之後與氧化鋁，利用擴散接合的方式，在氮氣氣氛下加熱至1072oC，持溫不同的時間製備銅/氧化鋁基板。以90o 剝離試驗評估製得基版的銅與氧化鋁間之剝離強度。研究剝離強度、預先氧化程度和擴散接合持溫時間三者的關係。三者之間的趨勢可以藉由XRD，EDS和SEM觀察銅和氧化鋁的破裂面得知。在進行剝離測試中，破裂是先從在氧化層中開始。隨氧化層越厚，接合試片之剝離強度越小。這也許是隨著在銅箔上預先氧化程度的增加，銅和氧化鋁之間未接合的區域也隨之增加。

關鍵字

直接敷合銅 ； 剝離強度 ； 預氧化 ； 擴散接合 ； 銅/氧化鋁

並列摘要

Diffusion bonded Cu/Al2O3 substrates were prepared by having pre-oxidized copper foil physically and chemically and then bonding with an alumina under flowing nitrogen atmosphere at 1072oC for various durations. The bond strength between copper and alumina would be tested by peel test. The relationship among peel strength, degree of pre-oxidation, and duration of diffusion bonding were studied. The reasons of these trends were reveal from the microstructures of the fracture surface on copper and alumina sides by XRD, EDS, and SEM. It is found that the fracture is occurred in the oxide layer during peel test. The thicker the oxide layer on the copper foil for bonding, the lower the peel strength will obtain for the boned substrate. That maybe attributed to the unbonded regions increase with increasing degree of pre-oxidation of copper foil.

並列關鍵字

Cu/Al2O3. ； diffusion bonding ； preoxidation ； Direct bonding copper ； peel strength

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