- 期刊
Fabricating a Heat Pipe Structure within a Radiating Plate for Electronics Fan-Less Cooling
並列摘要
This study presents a method for fabricating a conductive metal with a heat pipe structure integrally formed within a radiating plate, and the heat transfer channels are arranged in an orthogonal matrix. The developed heat transfer device is monolithic and seamless, thus achieving low heat resistance and high heat transfer efficiency. The high conductivity radiating plate discussed in this study has significantly improved structural strength and a complete hot spot contact for efficient cooling. Heat generated from a heat source is transferring without passing through different interfaces of materials or any solder paste within the high conductivity plate. The proposed heat transfer device is suitable for mounting in various heat transfer systems or heat dissipating modules. Therefore, electronic system cooling using a fan-less design will have potential improved heat transfer efficiency of about 33% by natural convection.
被引用紀錄
延伸閱讀
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