微機電技術於高功率LED構裝之應用

MEMS Technology on High Power LED Packaging

鄒慶福 ； 張君銘 ； 賴騰憲 ； 黃正翰

《國家奈米元件實驗室奈米通訊》 17卷3期 (2010/09) Pp. 22-28

https://doi.org/10.29913/NDLC.201009.0005

摘要

發光二極體(Light Emitting Diode, LED)具有高發光效率、使用壽命長與低電能消耗的特性，目前已逐漸的取代傳統的照明光源，然而在高亮度的應用層面需求下，如何有效的提高模組化元件的發光效率與散熱效能，已成為目前急待克服的關鍵項目。因此，本研究藉由微機電系統(MEMS)的體型微加工(Bulk micromachining)技術，開發出全新的LED模組化構裝技術來解決上述的問題。整個封裝架構整合了三個關鍵零組件：第一是具有反射杯凹槽與貫穿孔導線的矽封裝基板，其功能可降低熱應力並達到模組微小化的功能；第二是利用上述的矽基板結構與光阻塗佈製程，經由加熱使封閉氣體產生熱膨脹的方式，製作出晶圓級的非球面透鏡模仁，並透過翻模轉印技術，直接在光學膠體表面製作出透鏡結構，以提高元件的出光效率；第三是具有V型微流道之奏摺式矽散熱基板，可搭配冷卻風扇或是循環式微流體以強化散熱效果。目前相關元件的製作均驗證可行，相信這些相關技術的開發，未來可拓展至其他光電領域之應用。

關鍵字

發光二極體 ； 體型微加工 ； 構裝

並列摘要

Universal light emitting diode (LED) has superior characteristics such as long life, low power consumption, high brightness, and low cost. It has already begun to penetrate the display application and replaced the commercial lighting markets gradually. However, the thermal manage together with optical performance to high power LED devices are relevant to the efficiency of packaging design. These problems make the realization of high-brightness, high-density and low-cost luminous devices or displays difficult. To solve such problems, we proposed a solution for high power LED packaging by MEMS technology. The novel packaging module includes three components: one is the silicon-based packaging substrate which is formed with a depression and through-hole interconnects by bulk micromachining, another is the optical aspheric-lens element that fabricated by molding compound, the other is the silicon-based heat spreading substrate consists of V-groove microchannel and metal conducting layer. The expectable merits of the packaging module developed in this study not only solves thermal stress generation and improves optical quality, but enables new applications on specific semiconductor optoelectronic devices.

並列關鍵字

Light Emitting Diode, LED ； Bulk Micromachining ； Packaging