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高介電係數材料與多晶矽奈米線之非揮發性記憶體應用在三維快閃記憶體與顯示面板

High-k Materials and Poly-Si Nanowires in Nonvolatile Memory for 3D Flash Memory and Display Panel Applications

摘要


此論文提出兩種多晶矽-氧化矽-氮化矽-氧化矽-矽(SONOS)形式之非揮發性記憶體(Nonvolatile Memory, NVM)元件。第一種非揮發性記憶體(NVM)元件,是具有Pi型閘極(Pi-gate)和多晶矽奈米線通道(Poly-Si NWs)結構之氮化鉭-氧化鋁-氮化矽-氧化矽-矽(TaN-Al2O3-Si3N4-SiO2-Si, TANOS)非揮發性記憶體。此TANOS NVM具有快速的寫入/抹除(Program/Erase: P/E)速度,在閘極偏壓為18伏特(V)與10微秒(μs)操作之下,具有記憶窗口(ΔV(下標 th)為3伏特。在經過10^4次寫入/抹除週期,還能保持70%初始記憶窗口,並可實行2位元(2-bit)操作。另一個NVM元件是以氧化鉿(HfO2)作為電荷儲存層,同時具有Pi-gate和Poly-Si NWs結構之多晶矽-氧化矽-氧化鉿-氧化矽-矽(SOHOS)非揮發性記憶體。以氧化鉿(HfO2)作為電荷儲存層比起氮化矽(Si3N4)具有較高寫入效率,並且有更好的持久度和更多的寫入/抹除週期。

並列摘要


This work presents the feasibility of two Silicon-Oxide-Nitride-Oxide-Silicon (SONOS) type nonvolatile memory (NVM) devices. The first NVM device is TaN-Al2O3-Si3N4-SiO2-Si (TANOS) NVM with Pi-gate (π-gate) and poly-Si nanowire channels (NWs) structure. This TANOS NVM device is characterized by a fast program/erase (P/E) speed, a 3 V memory window (ΔV(subscript th)) that can be achieved by applying Vg=18 V in 10 μs, a feature in which 70% of the initial memory window is maintained after 10^4 P/E-cycle stress, and a two-bit operation. The other NVM device has a Pi-gate poly-Si NWs structure with a HfO2 charge trapping layer (SOHOS), as well as a HfO2 charge trapping layer that has a higher program efficiency, the better retention characteristics and more P/E cycles than that with the Si3N4 charge trapping layer.

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