本研究發展了一創新之光學關鍵尺寸量測(OCD)系統與技術,用以克服目前於先進封裝製程中,具高深寬比之微結構難以使用非破壞性檢測的困境。結合光譜反射術與光學散射術,並利用雷射寬頻光源的高空間同調性所設計之創新顯微光學架構,此技術可大幅提升量測之光效率,並在量測範圍上可實現單一結構的量測,避免了現存之光學量測技術限於量測多個結構之平均資訊的缺點,此為本技術的關鍵突破和特點。通過反向優化的最佳化工程,實驗驗證結果表明,本系統可同時量測線寬與線距為1μm、深寬比為3:1之RDL結構的多項關鍵尺寸資訊。
In this study, we proposed a novel optical critical dimension (OCD) metrology system for nondestructive inspection of high-aspect-ratio (HAR) microstructures used in advanced packaging processes. The proposed system involves the integration of spectral reflectometry and scatterometry techniques, and incorporates the high spatial coherence of a broadband laser source for optimal beam shaping. The proposed technique significantly enhances the measurement light efficiency and enables single-structure measurements, addressing the limitations of existing optical metrology techniques that rely on average information from multiple structures. With the proposed model-based measurement scheme for solving an inverse problem, experimental tests demonstrate that multiple CDs of a RDL structure with a fine nominal linewidth and spacing of 1 μm and an aspect ratio of 3:1 can be accurately measured.