六標準差管理於製程改善之運用－以主機板製造為例

Process Improvement by Six Sigma Management-A Case Study in Motherboard Manufacturer

李明賢(Ming-Hsien Caleb Li) ； 沈信亨(Hsin-Heng Shen)

《運籌研究集刊》 5期 (2004/06) Pp. 103-123

https://doi.org/10.7047/LRR.200406.0103

摘要

近年來國際大廠相繼運用六標準差的改善手法，改善品質並使企業獲利，使得六標準差管理的擴展就像野火般延燒至今，國內各型企業（漢翔、仁寶、車王、寶成…等）受到激勵亦相繼投入六標準差的改善活動，因此六標準差改善活動儼然成為這一波國內企業改造的主流趨勢，藉由實際專案的執行來達到企業減少浪費與增加獲利的雙重目的。本文就一主機板製造公司運用六標準差手法來改善製程中之主要元件―球狀格型陣列（Ball Grid Array, BGA）的不良率做個案分析，藉由DMAIC－定義、衡量、分析、改善與管制之推動模式，並運用流程分析、失效模式分析和田口方法等相關品管工具，使得BGA的不良率由5500ppm降低至3500ppm，大幅提高了生產力，並已成功地在該製造廠繼續執行中。

關鍵字

六標準差 ； 失效模式與效應分析 ； 田口方法 ； 球狀格型陣列

並列摘要

Recently, several American industries have introduced Six Sigma management. As a result, significant quality improvements are obtained and the profit increased. Six Sigma spread like wild fire forward the end of the 20th century. In Taiwan, the companies such as Aerospace, Compal, Mobiletron and Pou-Chen also introduced the up-to-date managerial tools. Consequently, Six Sigma become major stream for the improvement in the industry. Many cases study demonstrated that waste were eliminated and profit were increased by the implementation of project one by one. In this paper, a motherboard manufacturer which applies Six Sigma methodology to reduce the defect rate of the major component(Ball Grid Array, BGA)is studied. The steps of DMAIC-define, measure, analyze, improve and control are deployed. The following three modules-process mapping, failure mode and effect analysis and Taguchi method are implemented. The results reveal that the defect rate of BGA decreases from 5500ppm downs to 3500ppm and the productivity increases substantially. This study has now been successfully implemented in the manufacturer.

並列關鍵字

Six Sigma ； Failure Mode and Effect Analysis ； Taguchi method ； Ball Grid Array

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