新穎繞線於金屬凸塊製成之技術演進

技術演進(technology migration)在產品週期中扮演很重要的角色，比較被關注的項目為layout compaction 的重新使用和硬體程式語言的重新使用，但有關flip-chip的繞線卻乏人問津。錫球(bumps)的個數也隨著技術演進的腳步逐漸減少，因此在flip-chip上做RDL 繞線的問題越來越複雜。這篇論文是在解決在錫球(bumps)個數有限的情況下，如何在最短線長的目標下進行RDL 繞線，我們所採用的方法是minimum cost maximum flow 演算法，實驗結果顯示我們的方法可以比maze routing的方法線長減少約69%

關鍵字

科技演進；重配層繞線；覆晶技術

並列摘要

Technology migration plays a critical role in the time-to-market competition. Most existing works focus on layout compaction or hardware description language re-synthesis, and pay little attention to the I/O interface in flip chips. The complication of bumping process as well as electrical and reliability considerations prevent the bumps from scaling with transistor sizes. On the other hand, the number of signal bumps cannot be reduced and sometimes even increases due to the demands for wider bandwidth and various peripheral devices. As a result, the allocated die area for I/O can no longer afford the number of bumps a chip requires. This issue, known as bump encroachment, puts a stringent requirement on the redistribution layer (RDL) routing. In this paper, we first formulate the problem of RDL routing with bump encroachment, and then propose a network flow based algorithm to efficiently address it. Experimental results on a few benchmarks with parameters extracted from industrial designs show that compared with a maze routing-based approach, our algorithm can achieve up to 69% wirelength reduction.

並列關鍵字

Technology Migration ； RDL routing ； flip chip

參考文獻

[3] R. Saleh et al, “System-on-chip: reuse and integration,” in Proc of IEEE 94(6): 1050–1069, 2006

[4] S-Y. Chiang, “Foundries and the dawn of an open IP era,” Computer 34(4): 43–46, 2001

[7] E. Shaphir, R. Y. Pinter and S. Wimer, “Efficient cell-based migration of VLSI layout,” Springer, US, 2014

[8] S. Wimer, “Planar CMOS to multi-gate layout conversion for maximal fin utilization,” Integration, 47:115–122, 2014

[12] Hsu-Chieh Leey, Yao-Wen Chang, and Po-Wei Lee, “Recent Research Development in Flip-Chip Routing,” Proc. ICCAD, 2010.

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新穎繞線於金屬凸塊製成之技術演進

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