Thickness Scaling Characterization of Thermoelectric Module for Small-scale Electronic Cooling

熱電模組幾何特性於微電子冷卻之分析

吳坤憲(Kuen-Hsien Wu) ； 洪振益(Chen-I Hung)

《中國機械工程學刊》 30卷6期 (2009/12) Pp. 475-481

https://doi.org/10.29979/JCSME.200912.0004

摘要

熱電致冷系統是一種固態的冷卻裝置，其具有容易與高發熱量之電子元件整合之能力，應用於小型電子散熱極具潛力，本研究之目的即在尋找適當的熱電對厚度尺寸並且可以滿足所需要的熱通量及冷熱端溫差。本研究以20~2000μm熱電對厚度為研究對象，試圖建立一熱電耦合之模型並探討電流接觸電阻及基板傳導熱阻對熱電堆微小化之限制及對散熱能力之影響，結果顯示如果使用目前市面上可得之熱電材料(ZT=0.8)，厚度為200~2000μm的熱電對將無法滿足所需的熱通量，反之厚度為20μm的熱電對無足夠的冷熱端溫差，結果發現厚度為60~100μm之致冷系統可以得到較佳的熱通量及冷熱端溫差。

並列摘要

Thermoelectric cooler is a solid-state device with high capacity to be integrated with microelectronic components. Therefore, it is a potential candidate for small-scale cooling. The goal of this study is to seek for an appropriate range of thermoelectric pellet thickness to satisfy the desirable cooling power rate and temperature difference. The commercially available material of property ZT=0.8 was selected and the 3D electro-thermal analysis was carried out by using ANSYS. A scaling aspect was studied for pellet geometry and the range of pellet thickness was considered from 20μm to 2000μm. For a realistic condition, the electrical contact resistance and substrate thermal resistance were also included and investigated. Results revealed that the pellet thickness of 200~2000μm had low cooling power rate and the pellet thickness of about 20μm had insufficient temperature difference. Therefore, we suggest that the pellet thickness of 60~100μm can be adopted to provide desirable cooling power rate and temperature difference for small-scale cooling.

並列關鍵字

thermoelectric module ； scaling effect ； electronic cooling ； ANSYS