To understand the failure mode and the characteristics of life distribution of system or components of electronic products in a short time, accelerated test has become an important test in industry. Temperature, humidity, electricity voltage or the processing cycles stress are often the factors tested. In the traditional accelerated test, most of the generalized stress tests combine one or two elements. However, the research object of this dissertation, electronic connector pins, have already exhibit high reliability and great resistance to the simple environmental stress tests. In order to analyze their failure modes and the characteristics of life distribution more accurately, a multiple stress accelerated test is designed which includes factors such as temperature, humidity, density of mixed eroding gas, plugging and unplugging cycles, and plating thickness, latter of which has stress resistant capability itself. The methodology adopted here to analyze the experiment data is the nonlinear regression, based on reliability theory and applied to the accelerated model. If the life of connector pins under normal environment is defined as a normal life span. Research analysis shows that normal life span is 97.09 times more than the life span under the accelerated temperature 393 K condition, 1.23 times more under the accelerated humidity 90 % condition, 1.04 times more for plugging and unplugging cycles 300, and 1.72 times more under the accelerated eroding gas density 1.0, independently. The average life with plating thickness of 50 μ" in the regular environment is 28.1 years and its standard deviation is 10.5 years. 26.6 years of average life and 10.0 years of standard deviation are the data for plating thickness of 40 μ". 24.2 years of average life and 9.1 years of standard deviation are shown for plating thickness of 30 μ". 19.9 years of average life and 7.5 years of standard deviation are n for plating thickness of 20 μ".