5 μm全加成雙面軟板製程及其設備

近年來，為因應軟性電路板的市場需求及技術變革，工研院機械所致力於全加成雙面軟板製程的開發，以提升國內軟性電路板業者的技術能力及產品價值。全加成製程搭配超細微導線印刷技術具有綠色化製造、製程簡化、低成本…等優勢，搭配卷對卷薄膜傳輸及精密對位印刷技術，將可有效提高產量及良率。該項技術除可應用於雙面軟性印刷電路板外，也可用於電池、感測器及天線…等元件的製程。本文針對全加成雙面軟板製程技術及其設備進行深入探討。

關鍵字

軟性電路板；對位系統；超細線寬

並列摘要

In response to the market demand and technology changes of flexible printed circuit board (FPC), ITRI Mechanical and Mechatronics Systems Research Laboratories (MMSL) has developed additive processes for double-sided FPC processes to improve the technical capabilities and product value for domestic FPC vendors. The additive processes combined with ultra-fine conductive-line printing technology, precision positioning printing technology and roll-to-roll processes possess the advantages of green manufacturing, simplified fabrication process, and low cost production; allowing to increase production throughput and yield. This technology can also be applied to advanced electronic devices such as sensors, high frequency antenna, and battery, etc. In this paper, the additive processes and equipment for double-sided FPC are discussed in depth.

並列關鍵字

Flexible printed circuit board ； Alignment system ； Ultra-fine line

參考文獻

DIGITIMES 企劃 .(2016). 多層板與軟板的最新製程技術。 [Online]. Available: https://www.digitimes.com.tw/tw/dt/n/shwnws.asp?cnlid=13&id=0000458667_g0f5ybqn7fl1jm6s9oxva&ct=1

Google Scholar

Kumbhar, Y.(2017).Flexible Printed Circuit Boards Market by Type (Single-Sided FPCBs, Double-Sided FPCBs, Multilayer FPCBs, Rigid-Flex PCBs) - Global Opportunity Analysis and Industry Forecast, 2015-2022.,未出版.