超快雷射光學模組及雙層基板切割技術

Ultrafast Laser Optical Module and Double-layer Substrate Cutting Technology

陳園迪 ； 徐尚聿 ； 吳秉翰 ； 蔡武融 ； 劉松河

《機械工業雜誌》 431期 (2019/02) Pp. 15-21

摘要

本文聚焦於工研院所開發之波長轉換光學模組與雙層基板切割技術。將雷射之入射光波長轉換至雙層材料之共同透明波段，便可由一側進行切割，縮小製程複雜度。本方法可應用於切割微機電或光電半導體產品之基板，如矽基玻璃、硬脆材料、雙層基板及鍍膜玻璃等。工研院之技術與傳統輪刀技術相比，具備切割道邊緣崩角小，且無輪刀之磨耗問題。由於切割道寬度很小，因此單片晶圓可切割出更多顆晶粒，因此提高生產效率。

關鍵字

超快雷射切割 ； 雷射波長轉換 ； 雙層基板

並列摘要

The focus of this article is on the wavelength conversion optical module and double-layer substrate cutting technology being developed by Industrial Technology Research Institute (ITRI). By converting laser wavelength of incident beam to common transparent wavelength of the double-layer materials, cutting from one side and hence reducing process complexity are then possible. This method can be applied to cut substrates of MEMS or optoelectronic semiconductor products, such as silicon-on-glass, brittle materials, double-layer substrates and coated glass. Compared with conventional cutting wheel technology, the ITRI's technology has advantage of small chipping at cutting edge and without wear problem of the cutting wheel. Because of the narrow scribe lines, a wafer can be cut into more chips, thereby improving production efficiency.

並列關鍵字

Ultrafast laser cutting ； Laser wavelength conversion ； Double layer substrate

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