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Effects of Nanoindentation Depth and Annealing Temperature on Microstructural Evolution of Au/Cr/Si Thin Films

奈米壓深及退火溫度對金鉻矽薄膜顯微結構的影響

摘要


本研究主要是在金鉻矽薄膜上進行壓深1000nm之奈米壓深測試,並利用穿透式電子顯微鏡觀測未退火及經退火後之試片對應的顯微結構變化。在未退火之試片中,其負載-位移曲線中的卸載曲線具有pop-out之現象;且在界面區及壓痕區中分別形成鍊狀之結構及扭曲之晶格結構。然而,在250℃及350℃退火之試片中,壓痕區之顯微結構由扭曲之晶格結構轉換成非晶態之結構。當退火至450℃,由於較高之退火溫度及壓痕變形,在壓痕區中形成了非晶相與共晶相共存的顯微結構。

關鍵字

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並列摘要


Nanoindentation tests are performed on as-deposited Au/Cr/Si thin films to a depth of 1000 nm, respectively. The indentations in as-deposited and annealed specimens are examined using transmission electron microscopy (TEM). In the case of the as-deposited specimens, a pop-out feature is observed in the unloading curves and the indentation pressure induces a chain-like island structure and a distorted crystalline structure within the indentation zone. However, in the specimens annealed at temperatures of 250℃ and 350℃, respectively, the microstructure of the indentation zone changes from a distorted crystalline structure to an amorphous phase. At an annealing temperature of 450℃, the microstructure contains both amorphous phase and crystalline eutectic phase. The formation of eutectic phase is the result of a higher annealing temperature and a greater indentation deformation.

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