鎢粉與鈦粉之無電鍍銅研究

The Study on the Electroless Copper Plating of Tungsten and Titanium Powders

吳貞欽(J. C. Wu) ； 姜智豪(C. H. Chian)

《材料科學與工程》 36卷1期 (2004/03) Pp. 64-69

https://doi.org/10.6409/JMSE.200403.0064

摘要

利用無電鍍方式可以一種金屬粉體上披覆也種金屬形成複合粉未，以達到表面改質的目的，然而採用無電鍍技術製備複口粉未，常發生鍍液隱定性不佳或金屬披覆不均的現象。本研究嘗試利用控制鍍液組成與不同實驗條件，開發較為隱定且反應速率高之無電鍍技術，以期獲得較佳鍍層的金屬披覆粉未。研究內針對鎢粉與鈦粉進行無電鍍同實驗，並將製得之粉體進行ICP-AES成分分析與SEM表面觀察。由實驗結果顯示，鍍銅比例約在15%以下反應情況隱定，可製備良好之鎢/銅與鈦/銅複合粉未，其顏色均一，表面有明顯鍍層披覆。

關鍵字

無電鍍銅 ； 表面改質 ； 複合粉體

並列摘要

Metal powders can be plated to produce composite powders in order to change their surface properties by electroless plating method. But electrolyte instability and various plated proportion often occur. For developing stable and efficient electroless plating technique, we control the composition and proportion of the electrolyte in this investigation expected to get excellent plated composite powders. In this study, we proceed to develop electroless copper plating on tungsten and titanium powders and use ICP-AES and SEM observation on these produced composite powders. The results show that uniform coated W/Cu and Ti/Cu composite powders can be produced when the proportion of plated copper is under 15%.

並列關鍵字

Electroless copper plating ； Surface property improvement ； Composite powders