無電鍍Ni-Cu-P電化學性質研究

A Study on the Electrochemical Behavior of Electroless Ni-Cu-P Alloys

黃志堅(Jyh-Jian Huang) ； 蔡文達(Wen-Ta Tsai) ； 李汝桐(Ju-Tung Lee) ； 洪銘盤(Ming-Pan Hung)

《鑛冶：中國鑛冶工程學會會刊》 38卷3期 (1994/09) Pp. 107-116

摘要

本研究主要是討論無電鍍Ni-Cu-P合金在硫酸、氯化鈉及氫氧化鈉水溶液中之耐蝕性質及陰極極化行為，此無電鍍層是析鍍在中碳鋼上。以動電位極化曲線（Potentiodynamic polarization curve），評估無電鍍Ni-Cu-P鍍層中銅含量的改變對此材料在硫酸、氯化鈉及氫氧化鈉水溶液中之耐蝕性質的變化，並利用定電位的實驗方法，來討論無電鍍Ni-Cu-P之表面形態對陰極極化行為的影響。由陽極極化曲線的結果顯示，無電鍍Ni-Cu-P鍍層中銅含量的增加，使得腐蝕電位往較鈍性的電位偏移，且有較低的陽極電流密度，確實有助於耐蝕性的提升。掃描電子顯微金相顯示無電鍍Ni-Cu-P表面形態與無電鍍Ni-P二元合金不同，前者呈優先方向析出的特徵，而後者則呈三維等方向成長的現象。由電流密度對時間的關係圖的結果顯示，無電鍍Ni-Cu-P表面積的增加，有助於催化氫離子的還原。

並列摘要

The electrochemical behavior of electrolesly plated Ni-Cu-P alloys in sulfuric acid, sodium chloride and sodium hydroxide solutions were investigated. The influence of copper content on the corrosion behavior of the Ni-Cu-P alloy in the above three different solutions were evaluated by conducting potentiodynamic polarizartion curve measurements. The effect of surface morphology on the cathodic polarization behavior was also estimated. The results of potentiodynamic polarization curve measurements show that the corrosion potential (E_(corr)) of the Ni-Cu-P alloy shifts to a more noble value and its anodic current density is lowered with increasing Cu content in the deposit. Under cathodically potentiostatic condition, a higher apparent cathodic current density has been observed for the Ni-Cu-P alloy than for the Ni-P alloy, indicating that the former is more effective in catalyzing hydrogen evolution reaction by exhibiting a high effective surface area.