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粉末的熱圓化與透光氧化鋁製作

Particle Rounding Heat Treatment and Fabrication of Translucent Alumina

摘要


本研究觀察是否能藉熱處理技術圓化(Rounding)次微米級氧化鋁粉末粒體,提高製作之生坯密度,以於1600℃製得透光氧化鋁。研究使用住友化學AKP-53平均粒徑180 nm之α-Al_2O_3粉末。將其以氧化鋁球球磨解凝後,熱處理圓化,於800℃作1、6、12及24小時持溫。圓化後之粉末以注漿成形法獲得生坯。坯體添加500 ppm的Mg^(2+)後,於真空環境下以1600℃進行燒結。粉末圓化依據粉末之比表面積與粒徑分布及d_(20)-d_(80)變化評估。研究發現先經800 ℃ 熱處理圓化之粉末,其粒體外型變圓,且粒徑分布窄化,以之注漿成形者,可獲得較高生坯密度,可達相對密度66%。提高生坯密度有利於陶瓷體之透光燒結。於真空環境下以1600℃/2h燒結,平均晶粒大小為8.6 μm,直線透光率為5.18%。

並列摘要


In this study we used heat treatment for rounding sub-micron alumina particles to enhance the packing density of Commercial α-Al_2O_3. We used AKP-53 α-Al_2O_3 with a mean particle size 180 nm as the base materials. The base materials were de-agglomerated and thermal-treated at 800 ℃ for 1, 6, 12, and 24 hours. The rounded partilcles with 500 ppm Mg^(2+) additives were molded by solid slip casting methods. The compacts were vacuum sintered at 1600 ℃for 2 hours. We examined the heat treatment effect in terms BET-specific surface area, particle size distribution and d_(20)-d_(80) ratios. Results showed that the thermal-treatments brought about improved particle roundness and narrowed particle size distribution. Compacts with packing density up to 66% were fabricated. A translucent alumina with grain size 8.6 μm and RIT (Real In-line Transmittance) 5.18% was fabricated by the particle rounding heat treatments.

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