In tofu making by heat treatment, the heating rate and final temperature of whey, and the timing and concentration of coagulant addition are the two most dominant factors. This study explores the correlation of tofu quality with the above two factors under direct-current ohmic heating. Tofu product is obtained by pressing coagulating tofu curd. The quality of tofu product is assessed with electrical conductivity of whey residue and penetrometer measurements. The results show that the electrical conductivity is proportional to heating rate and concentration of coagulant addition. Tofu product from the heating rate of 0.062℃/s has lower crispness, hardness, and elasticity. The three indices are the largest at gelation under 1.0% GDL in comparison with gelations under 0.5% and 1.5% GDL.