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A Pulsed RF Sputtering Method for Obtaining Higher Deposition Rates
並列摘要
A novel sputtering method for depositing thin films of Nickel ferrite (NiFe2O4) is introduced in this report. This method can possibly be used to synthesize thin films of other oxide materials as well. The deposition rate can be increased tremendously using a pulse-like rf sputtering method. The highest deposition rate provided by pulsed rf sputtering was measured to be 3.78 times higher than that of films deposited by normal rf sputtering. The magnetic and structural properties of the Nickel ferrite films remained the same as those of films fabricated by the normal rf sputtering method, according to the X-Ray diffraction patterns and magnetic hysteresis loops. PACS. 67.70.+n - Films (including physical adsorption).PACS. 68.55.Jk - Structure and morphology; thickness.
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