真空連鑄純銅微組織模擬技術與實驗驗證

Numerical Simulation of Solidification Morphologies of Pure Copper by Vacuum Continuous Casting Using a Cellular Automaton Model and Its Experimental Verification

蔡德昌(D. C. Tsai) ； 黃文星(W. S. Hwang) ； 蔣承學(C. S. Jiang)

《鑄造工程學刊》 35卷2期 (2009/06) Pp. 13-19

https://doi.org/10.29809/JTFS.200906.0002

摘要

本研究的主要目的是發展出一套模擬系統，在真空連續鑄造製程下，有效預測凝固過程的微觀組織形態，並進一步與實際的實驗結果相驗證。本模擬系統主要針對巨觀的熱傳系統與微觀的晶粒成核成長系統進行耦合。熱傳方面，主要採用有限差分法(FD)進行計算，晶粒的成核成長則採用Cellular Automaton method (CA)建立。從實驗的結果可以得知，連鑄的引拔速度是主要的影響因素，隨著連鑄速度的增加，可以獲得不同的微觀組織形態，並且凝固的固液界面也有往石墨模具出口的位置接近，這有可能引發連鑄漏液湯的危險。最後經由CA法所建立的微組織模擬預測系統與實際連鑄實驗結果是相接近的。

關鍵字

真空連續鑄造 ； 元胞自動機 ； 無氧銅 ； 微組織模擬

並列摘要

The purpose of this study is to predict the morphologies of the solidification process for pure copper by vacuum continuous casting (VCC) and verify its accuracy by the observed experimental results. Finite differential method and cellular automaton (CA) model were utilized to simulate the macro-temperature field, nucleation and grain growth of pure copper using real data from actual casting operations. From the observed experiment, the preliminary effective parameter is drawing speed of the VCC process. With the increase of drawing speed, morphologies of the copper will change and the position of liquid-solid zone move closer to the orifice of the mold. The solidification morphologies by CA model were corresponding to the result of actual casting experiment well.

並列關鍵字

Vacuum Continuous Casting ； Cellular Automaton ； Oxygen-Free Copper ； Microstructure Simulation