The Design of Master Production Scheduling System for Ball Grid Array Packaging Process

球格陣列封裝製程之主生產排程系統設計

鍾淑馨(Shu-Hsing Chung) ； 高清貴(Ching-Kuei Kao) ； 黃羑群(Yu-Chun Huang) ； 莊書銘(Shu-Ming Chuang)

《工業工程學刊》 23卷3期 (2006/05) Pp. 245-252

https://doi.org/10.29977/JCIIE.200605.0008

摘要

球格陣列封裝廠具有機台整備時間長、訂單動態來到以及產品會再回流等三大特性。這三大特性使得球格陣列封裝廠難以在考慮最大化產能利用的情況下同時維持高訂單達交率。本文的目的即在設計一主生產排程系統，用以規劃主生產排程使其滿足高訂單達交率的需求。為了達成此目標，首先粗略估算生產週期時間，其次使用混合整數規劃模型求解最佳的機台整備排程。根據此機台整備排程，進而求得主生產排程。結果顯示，本文之主生產排程系統所規劃之主生產排程可滿足高訂單達交率。

關鍵字

主生產排程 ； 球格陣列封裝 ； 整備時間 ； 混合整數規劃

並列摘要

The wafer bumping process in Ball Grid Array (BGA) packaging has three characteristics: long machine setup time, dynamical arrival of orders, and re-entrance of operations. These three properties make a factory with BGA packaging difficult to maximize its capacity utilization while having all orders meeting their due dates. Therefore, we design a master production scheduling (MPS) system for wafer bumping process which aims for having high due date achievement as well as doing customer order promising. The MPS system first estimates the cycle time roughly. Then a mixed integer programming (MIP) model is applied to optimize the setup schedule. With estimated cycle times and setup schedules, the master production scheduling system can plan master production schedules which are capable to meet the due date requirement and can handle the task of customer order promising. The case studies show that this MPS system generates feasible master production schedules with high due date achievement.

並列關鍵字

Master Production Scheduling ； Ball Grid Array Packaging ； Setup Time ； Mixed Integer Programming

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