以濺鍍方式在電子産品塑膠外殼上披覆金屬薄膜以達到電磁波幹擾遮蔽之效果

Using Sputtering System to Deposit a Metal Film on IT Products to Shield Electro Magnetic Interference

吳威逸(W.Y. Wu) ； 劉至祥(Jason Liu) ； 黃光昭(K.C. Hang) ； 陳博裕(Solomon Chen)

《真空科技》 17卷3期 (2004/11) Pp. 51-57

https://doi.org/10.29808/JVSROC.200411.0009

摘要

本實驗主要以磁控式真空濺鍍方式在電子産品的塑膠外殼內層披覆上一層金屬薄膜，膜厚控制在0.5um左右，利用磁式真空濺鍍的金屬薄膜具有高導電性質、金屬原子沉積後的膜層表面緻密性高、製程溫度低、鍍膜後産品組裝較容易而且製程環保無汙染等特性，來達到符合電子産品需要調整運轉、高頻計算而容易産生較高能量之電磁波的情形下，也能産生高抗電磁波幹擾〈Electrical Magnetic Interference〉的效果，使得電磁波無法對電子産品的正常運作産生影響。

並列摘要

Our experiments are focused on depositing metal thin film by sputtering system. The thickness of metal thin films is about 0.5um.Using metal thin film to shield EMI have some remarkable characteristics, such as high conduct ability, high density films, producing with low temperature, no pollution, and easier for sequent packaging. High EMI shielding effect can protect IT produces form EM wave damage from high speed working and high frequency calculating process.