利用能帶工程的方法設計出具有漸變鋁成分的電子阻擋層(GEBL)的氮化鎵發光二極體(Light-emitting Diodes, LEDs),其中電子阻擋層鋁的成分沿著[0001]方向增加。由模擬結果可以看到GEBL大幅改善電洞在電子阻擋層的傳輸效果,同時也增強了電子阻擋層侷限電子的能力。接著我們利用金屬有機化學氣相沉積(Metal-organic Chemical Vapor Deposition, MOCVD)成長出的GEBL發光二極體相對於傳統發光二極體,擁有較小的操作電壓與串聯電阻值,並且在高電流密度下擁有較高的輸出功率。同時在電流密度為200A/cm^2下,效率隨電流增大而降低的效應也達到大幅的改善,傳統發光二極體效率遞減34%而GEBL發光二極體只有4%。
A graded-composition electron blocking layer (GEBL) with aluminum composition increasing along [0001] direction was designed for GaN-based light-emitting diodes (LEDs) by employing the band engineering. The simulation results demonstrated that such GEBL can effectively enhance the capability of hole transportation across the EBL as well as the electron confinement. Consequently, the LED with GEBL grown by metal-organic chemical vapor deposition exhibited lower forward voltage and series resistance, and much higher output power at high current density, as compared to conventional LED. Meanwhile, the efficiency droop was reduced from 34% in conventional LED to only 4% from the maximum value at low injection current to 200 A/cm^2.