CMOS MEMS製程平台於微感測器之應用

Sensors Integration Using CMOS MEMS Platform

方維倫(Wei-Leun Fang) ； 孫志銘(Chih-Ming Sun) ； 蔡明翰(Ming-Han Tsai) ； 劉育嘉(Yu-Chia Liu)

《科儀新知》 172期 (2009/10) Pp. 80-89

https://doi.org/10.29662/IT.200910.0011

摘要

筆者曾於科儀新知第165期（2008年8月）中介紹如何利用TSMC標準CMOS製程，開發CMOS MEMS微加速度計。筆者想進一步藉由本文介紹如何延伸IC製程平台(process platform)的觀念，利用上述TSMC標準製程，輔以一套由筆者研究團隊建立的後製程，完成CMOS MEMS微感測器之製造與整合。本文希望以筆者研究團隊在國立清華大學微機電實驗室所開發之一系列微型感測器為例，其中包含了三軸加速度計、溫度感測器、壓力計與觸覺感測器，來完整說明CMOS MEMS元件設計、製造與測試的完整流程，並如何利用CMOS MEMS製程平台製造與整合。

並列摘要

The authors have reported the design and implementation of CMOS MEMS accelerometer in Instruments Today (August, 2008). In this article, the authors would like to further introduce the concept of CMOS MEMS fabrication platform. The design and fabrication of various micro sensors, including tri-axis accelerometer, temperature sensor, pressure sensor and tactile sensor, is discussed. Moreover, the monolithic integration of these micro sensors on a single chip is also available using the present CMOS MEMS platform. In application, the sensors implemented by the author's research group in the Micro-Device Lab., National Tsing Hua University are demonstrated. These sensors are fabricated using the TSMC 0.35 mm standard CMOS process plus the post-CMOS integration platform developed by authors.