裝配程序規劃之局部裝配擷取

Subassembly Extraction in Assembly Sequence Planning

黃開義(Kai-I Huang) ； 吳松達(Song-Dar Wu)

《大葉學報》 2卷1期 (1993/12) Pp. 49-66

https://doi.org/10.7119/JDYU.199312.0049

摘要

現今產業對於複雜之裝配件常採用局部裝配的方式，來減低裝配排序之複雜性。本研究為達到擷取局部裝配之目的，首先分析裝配零件間之結合關係，建立接合接觸圖，以找出局部裝配之關鍵零件。其次將結合兩個關鍵零件間的接合關係拆除，並分析其可行性，得到相互獨立之穩定局部裝配。接著以裝配的時間因素為考量，評估各可行局部裝配知之拆卸方法，以選出裝配時間最佳之局部裝配。研究中採用矩陣的表示方式，並提出演算法則，以利電腦化之作業。最後以一實例來驗證本研究所提出之方法。

關鍵字

局部裝配擷取 ； 接合接觸圖 ； 關鍵零件

並列摘要

Subassembly approach has been applied by today's industry to reduce the complexity of assembly sequencing for complex assemblies. By analyzing assembly mating conditions, a connection-contact graph is constructed to identify the key components for subassembly extraction. After removing the connection between key components, independent and stable subassemblies can be obtained. In addition, assembly time is applied to evaluate different subassembly combinations for the selection of better subassembly extraction. Matrix representation and algorithm are proposed for computerization. Finally, an example is presented for the study.

並列關鍵字

subassembly extraction ； connection-contact graph ； key components