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利用單分子層摻雜技術並結合微波和CO_2雷射退火製作摻雜層小於5奈米的多晶矽無接面電晶體

Poly Si Junctionless Transistors with Sub- 5nm Conformally Doped Layers by Molecular Monolayer Doping and Microwave Incorporating CO_2 Laser Annealing

摘要


本研究群提出了一種新型的殼層摻雜結構之無接面多晶矽薄膜電晶體,此方法利用單分子摻雜層技術,並且結合了微波和CO_2雷射退火的方式。利用微波的退火,形成了超淺(次5nm)且陡(< 0.8nm/ dec.)的摻雜分布。此外,由於CO_2雷射的吸收方式能避免摻雜物擴散,因此在本研究中,本研究群利用微波後加上CO_2雷射的處理增加摻雜的活化能力並修補多晶矽的缺陷。最後,利用此方式,吾人製做了無接面多晶矽薄膜電晶體,其擁有極佳的閘極控制能力(電流開關比>10^7),未來可以應用於3D ICs上。

並列摘要


A novel conformal shell doping profile (SDP) junctionless (JL) fin thin film transistor (FinTFT) formed by a damage-free molecular monolayer doping (MLD) method and a combination of microwave annealing (MWA) and CO_2 laser spike annealing (COLSA) is proposed and studied. Thanks to microwave annealing, an ultra-shallow (sub 5nm) and steep (< 0.8 nm/dec) doping profile is obtained. Moreover, the nonmelting COLSA can avoid dopant diffusion. As a result, we combine MWA and COLSA to enhance dopant activation and recover defect in our research. Finally, by the hybrid method, the JLFinTFT shows superior gate control (Ion/Ioff >10^7) for 3D stacked ICs applications in the future.

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