基於QFD與FMEA的TFT-LCD工業包裝設計研究

TFT-LCD Industrial Packaging Design Based on QFD and FMEA

劉說芳(Shuo-Fang Liu) ； 李雁隆(Yann-Long Lee) ； 高鳳如(Feng-Ru Gau)

《設計學報》 17卷4期 (2012/12) Pp. 63-78

https://doi.org/10.6381/JD.201212.0063

摘要

在全球性競爭的環境下，企業面對顧客複雜而多樣化的需求，更須善用市場資訊來開發符合其需求的新產品。因此，如何透過將顧客需求轉換為產品開發目標之方式，並進行整體產品開發系統的風險規劃及管理，預防潛在性的失效發生，將低產品開發專案的不確定因素，以達到滿足顧客需求之使命確實至為重要。本研究基於品質機能展開法（QFD）及與失效模式與效應分析（FMEA）等兩二方法，並以光電科技產業TFT-LCD模組半成品運輸之工業包裝設計產品開發作為研究案例；首先進行顧客問卷調查作為選擇需求項目的依據，其次再以品質機能展開法結合失效模式與效應分析做為顧客需求重要性的評定標準，經由QFD I、II、III與DFMEA I、II等階段性的交互評估探討，找出產品設計的關鍵因子。經過實驗及驗證後，其結果顯示本方法確實能有效的降低因設計所造成的產品不良及的客訴案件，原平均半年有4.75件的客訴，經導入此研究方法後，追蹤100年2至7月，期間已減至僅有1件客訴案例，顯示其方法確屬有效。本研究在包裝產品開發程序上訴諸的方法應用，經實驗的結果顯示在產品關鍵特質的設計階段，確實有助於企業更快速且更精確的完成新產品的開發，減少可能發生之損失並提升競爭力。

關鍵字

顧客需求 ； 包裝設計 ； 品質機能展開 ； 失效模式與效應分析

並列摘要

Nowadays, developing competitive products is becoming more and more important in global business. Therefore, how to convert customer needs into product features, preventing potential failures, and reducing uncertainties in product development will be a major issue in enhancing competitiveness. This research integrated the methods of Quality Function Deployment (QFD) and Failure Mode and Effects Analysis (FMEA) to develop the industrial packaging design for semi-finished product transportation of TFT-LCD Module. First, a questionnaire was used as the basis for identifying customer needs. Next, QFD I, II, III and DFMEA I, II were used to determine the priority of the essential factors in product feature and quality. Through experiments and validation, the results shown that the procedures and the methods of this research could effectively reduce the number of customer complaints caused by poor design quality. For instance, after we applied the methods of this research to the product development process, the number of customer complaints, which was originally 4.75 in every six months averagely, had reduced to 1 from February to July in 2011. Therefore, we concluded that the method proposed in this research is effective.

並列關鍵字

Customer needs ； Industrial Packaging Design ； Quality Function Deployment (QFD) ； Failure Mode and Effects Analysis (FMEA)

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